Loading...

TXDV612

STMicroelectronics

TXDV612 by STMicroelectronics

TXDV612 by STMicroelectronics is a TRIAC designed for AC control applications, featuring a max RMS on-state current of 12 A and a repetitive peak off-state voltage of 600 V. It operates in temperatures from -40 °C to 125°C. This reliable component ensures efficient switching with low leakage currents.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,522 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,522

-

-

-

-

Anansix

USA . 850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

850

-

-

-

-

ECAB

Sweden . 658 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

658

-

-

-

-

Vyrian

USA . 367 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

367

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 156 parts In-Stock

1+ parts

$4.278

100+ parts

-

1k+ parts

$3.850

10k+ parts

-

156

$4.278

-

$3.850

-

MKK Technologies

India . 240 parts In-Stock

1+ parts

$8.044

100+ parts

-

1k+ parts

-

10k+ parts

-

240

$8.044

-

-

-

DigiPath Technology Company

USA . 240 parts In-Stock

1+ parts

$8.044

100+ parts

-

1k+ parts

-

10k+ parts

-

240

$8.044

-

-

-

Corphita

USA . 4,059 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,059

-

-

-

-

Parana Technologies

USA . 305 parts In-Stock

1+ parts

-

100+ parts

$5.115

1k+ parts

-

10k+ parts

-

305

-

$5.115

-

-

Overview

Unlock the power of seamless control with the TXDV612 TRIAC from STMicroelectronics. Renowned for quality and reliability, STMicroelectronics delivers a robust solution that excels in diverse applications, from lighting systems to motor controls. With its compact design, exceptional performance at elevated temperatures, and low leakage currents, the TXDV612 enhances efficiency while ensuring safety. Elevate your projects and experience unmatched value, durability, and innovation with this superior component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the TRIAC suitable for a variety of applications.

Maximum DC Gate Trigger Current: 100 mA

A maximum gate trigger current of 100 mA allows for efficient triggering with lower power requirements, enhancing the overall energy efficiency.

Configuration: SINGLE

The single configuration simplifies the design and integration into circuits, making it easier for engineers to implement.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient use of space on PCBs, optimizing layout options for various applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide enhanced mechanical stability and durability in high-impact applications, ensuring reliable performance.

Maximum Leakage Current: 2 mA

A low leakage current enhances energy efficiency and reduces power losses, making this TRIAC environmentally friendly.

Maximum Repetitive Peak Off-state Leakage Current: 10 uA

This minimal off-state leakage current ensures that more power is available for output, making it ideal for high-efficiency designs.

No. of Terminals: 3

Having three terminals allows for versatile connections and easy integration into control circuits, enhancing design flexibility.

Package Style (Meter): FLANGE MOUNT

The flange mount design contributes to secure mounting and improved thermal dissipation, ensuring robust operation under load.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this TRIAC can be used in high-temperature environments, enhancing its range of applications.

Trigger Device Type: ALTERNISTOR TRIAC

The use of an alternistor TRIAC allows for swift and precise switching, contributing to the effectiveness in AC applications.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature expands operational capability, making this TRIAC suitable for extreme environments.

Terminal Finish: MATTE TIN

The matte tin finish enhances the corrosion resistance of terminals, ensuring long-term reliability in diverse environmental conditions.

Terminal Position: SINGLE

The single terminal position aids in straightforward circuit design and layout, simplifying assembly and maintenance.

Maximum RMS On-state Current: 12 A

A high on-state current rating ensures the TRIAC can handle substantial loads, making it suitable for heavy-duty applications.

Maximum DC Gate Trigger Voltage: 1.5 V

This low trigger voltage requirement ensures ease of operation with minimal energy consumption, promoting efficiency.

Case Connection: ISOLATED

An isolated case connection enhances safety by preventing unintended circuit interference, ensuring reliable operation.

Repetitive Peak Off-state Voltage: 600 V

A high off-state voltage rating allows for safe operation in applications with significant voltage levels, broadening application potential.

Minimum Critical Rate of Rise of Commutation Voltage: 10 V/us

This low rate allows for effective switching without causing voltage spikes that can damage components, promoting system longevity.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

This rapid voltage rise capability facilitates quick switching operations, improving overall system performance in dynamic applications.

Maximum Holding Current: 100 mA

A maximum holding current of 100 mA ensures reliable operation in low-power scenarios, enhancing versatility in control applications.

Reference Standard: UL RECOGNIZED

Having UL recognition indicates compliance with safety standards, providing assurance regarding the quality and reliability of the product.

Technical Specifications

Triode For Alternating Current (TRIAC) TXDV612 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

10 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

100 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

100 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

12 A

Reference Standard:

UL RECOGNIZED

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

TXDV612 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19