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MAC15A10FP

Onsemi

MAC15A10FP by Onsemi

MAC15A10FP by Onsemi is a TRIAC with 15A RMS current, 800V repetitive peak off-state voltage, and 50mA DC gate trigger current. It is used in applications requiring isolated case connection, such as motor control systems and lighting dimmers.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Extreme Components

USA . 4,657 parts In-Stock

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Vyrian

USA . 1,733 parts In-Stock

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Digiode

USA . 566 parts In-Stock

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TANS Electronics

Latvia . 6,442 parts In-Stock

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Authorized Procurement Solutions

USA . 5,500 parts In-Stock

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5,500

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Kulean Microsystems

USA . 5,472 parts In-Stock

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Problanco Electronics

Mexico . 2,237 parts In-Stock

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SupplyDigital Components

Austria . 506 parts In-Stock

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Corohmni

South Africa . 405 parts In-Stock

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Corphita

USA . 288 parts In-Stock

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UHIMA Technologies

Türkiye . 11 parts In-Stock

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Assy Fe

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Overview

Experience unparalleled quality and reliability with the MAC15A10FP by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch products like the MAC15A10FP, a Triode For Alternating Current (TRIAC) that offers exceptional performance and durability. Ideal for a variety of applications, this product provides value, benefits, and advantages to customers seeking a reliable and efficient solution. Trust Onsemi for all your TRIAC needs and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Maximum DC Gate Trigger Current: 50 mA

High maximum DC gate trigger current ensures reliable and efficient operation.

Configuration: SINGLE

Single configuration simplifies the setup and installation process.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and placement within circuits or systems.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and stable connections in circuit boards.

Maximum Leakage Current: 2 mA

Low maximum leakage current ensures energy efficiency and minimizes power loss.

No. of Terminals: 3

Three terminals provide flexibility in connecting the triode to other components or circuits.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers easy installation and secure mounting options.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the triode to operate in various environmental conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

4 Quadrant logic level TRIAC ensures precise and efficient triggering for smooth operation.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables the triode to function in cold environments without any issues.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures good conductivity and reliable connections.

Terminal Position: SINGLE

Single terminal position simplifies the wiring process and ensures easy integration.

Maximum RMS On-state Current: 15 A

High maximum RMS on-state current allows the triode to handle heavy loads with ease.

Maximum DC Gate Trigger Voltage: 2 V

Low maximum DC gate trigger voltage ensures efficient and responsive triggering.

Case Connection: ISOLATED

Isolated case connection ensures safety and prevents electrical interference.

Repetitive Peak Off-state Voltage: 800 V

High repetitive peak off-state voltage allows the triode to withstand high voltage fluctuations.

Maximum Holding Current: 40 mA

High maximum holding current ensures stable operation once the triode is triggered.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC15A10FP attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

40 mA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

15 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC15A10FP Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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