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TSM1013IDT

STMicroelectronics

TSM1013IDT by STMicroelectronics

TSM1013IDT by STMicroelectronics is a versatile power management IC designed for applications requiring efficient voltage regulation. It operates b/w 4.5V and 28V, with a max current of 1mA and supports temperatures from 0 °C to 105 °C. Its compact SO8 package makes it ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,241 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,241

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-

-

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Anansix

USA . 2,126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,126

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Vyrian

USA . 2,114 parts In-Stock

1+ parts

-

100+ parts

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2,114

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,130 parts In-Stock

1+ parts

$0.400

100+ parts

-

1k+ parts

-

10k+ parts

-

2,130

$0.400

-

-

-

Microchip USA

USA . 267 parts In-Stock

1+ parts

$12.895

100+ parts

-

1k+ parts

-

10k+ parts

-

267

$12.895

-

-

-

AZTECH Wire

Italy . 215 parts In-Stock

1+ parts

$15.520

100+ parts

-

1k+ parts

-

10k+ parts

-

215

$15.520

-

-

-

IDEA Electronic Components Group

UK . 164 parts In-Stock

1+ parts

$16.922

100+ parts

-

1k+ parts

$15.229

10k+ parts

-

164

$16.922

-

$15.229

-

MKK Technologies

India . 650 parts In-Stock

1+ parts

$31.820

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$31.820

-

-

-

DigiPath Technology Company

USA . 650 parts In-Stock

1+ parts

$31.820

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$31.820

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Component Stockers USA

USA . 481 parts In-Stock

1+ parts

$99.990

100+ parts

-

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10k+ parts

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481

$99.990

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-

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Kepictronics

USA . 13,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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13,000

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A-Z Elektronik GmbH

Germany . 6,026 parts In-Stock

1+ parts

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6,026

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Corphita

USA . 4,513 parts In-Stock

1+ parts

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4,513

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Authorized Procurement Solutions

USA . 4,257 parts In-Stock

1+ parts

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4,257

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Parana Technologies

USA . 1,633 parts In-Stock

1+ parts

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100+ parts

$20.232

1k+ parts

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10k+ parts

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1,633

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$20.232

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Overview

Unlock the potential of your designs with the TSM1013IDT from STMicroelectronics, a leader in power management solutions. This compact, high-performance IC offers unmatched reliability and efficiency, ensuring optimal power supply support across various applications. With its robust construction and advanced features, you can count on exceptional performance and longevity, making it the perfect choice for automotive, industrial, and consumer electronics. Elevate your projects with STMicroelectronics' commitment to quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides durability and protection against environmental factors, making the IC reliable in various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact circuit designs, optimizing space and enhancing performance in modern electronics.

Package Shape: RECTANGULAR

The rectangular shape is standard for many PCB layouts, facilitating a straightforward design process and improving assembly efficiency.

Nominal Supply Voltage (Vsup): 18 V

With a nominal supply voltage of 18 V, this IC is suitable for a wide range of applications, ensuring stable and reliable operation within its specified limits.

Power Supplies (V): 18

Supports a power supply of 18 V, making it versatile for various power management applications, including industrial and consumer electronics.

No. of Terminals: 8

The 8-terminal configuration provides ample connectivity options while keeping the design compact, making it easier to integrate into space-constrained designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes footprint, allowing for denser circuit designs without compromising performance or reliability.

Maximum Operating Temperature: 105 °C

Capable of operating at temperatures up to 105 °C, this IC is suitable for use in high-temperature environments, ensuring reliability in demanding applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this IC can function in various environments, making it adaptable for multiple applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold plating provides excellent corrosion resistance and enhanced electrical performance, increasing the longevity and reliability of the connections.

Terminal Position: DUAL

The dual terminal position improves mounting flexibility, allowing for efficient PCB layout and simplified assembly processes.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm ensures compatibility with low-profile designs, promoting space-saving solutions in compact electronic devices.

Width: 3.9 mm

At just 3.9 mm wide, this IC aids in achieving compact designs, ideal for applications where every millimeter counts.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is designed to manage and optimize various power requirements, enhancing overall system efficiency.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5 V, this IC operates effectively in low-voltage applications, broadening its usability for diverse projects.

Length: 4.9 mm

A length of 4.9 mm makes this IC suitable for compact PCB layouts, allowing for a streamlined design and incorporation into small devices.

Maximum Supply Current (Isup): 1 mA

The maximum supply current of 1 mA ensures low power consumption, making it an energy-efficient choice for battery-operated applications.

Terminal Form: GULL WING

The gull wing terminal form provides excellent solderability and mechanical strength, ensuring reliable connections in surface mount applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm enables compatibility with a variety of PCB designs, facilitating easy integration into existing layouts.

Maximum Supply Voltage (Vsup): 28 V

With a maximum supply voltage of 28 V, this IC is applicable in high-voltage scenarios, expanding its usability in more demanding power management situations.

Technical Specifications

Power Management ICs TSM1013IDT attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

18

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

18 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TSM1013IDT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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