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TSM1013AID

STMicroelectronics

TSM1013AID by STMicroelectronics

TSM1013AID by STMicroelectronics is a versatile power management IC with an 18V nominal voltage, operating b/w 4.5V and 28V. It features an 8-terminal gull-wing design and operates in temperatures from 0 °C to 105 °C. Ideal for compact power supply applications, it ensures efficient performance in small electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 22,400 parts In-Stock

1+ parts

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22,400

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Vyrian

USA . 5,055 parts In-Stock

1+ parts

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5,055

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Anansix

USA . 1,989 parts In-Stock

1+ parts

-

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1,989

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Digiode

USA . 925 parts In-Stock

1+ parts

-

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-

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925

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EMSNET

USA . 100 parts In-Stock

1+ parts

-

100+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$0.780

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

$0.780

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-

-

Microchip USA

USA . 1,458 parts In-Stock

1+ parts

$7.386

100+ parts

-

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-

10k+ parts

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1,458

$7.386

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AZTECH Wire

Italy . 979 parts In-Stock

1+ parts

$13.310

100+ parts

-

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979

$13.310

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-

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IDEA Electronic Components Group

UK . 1,956 parts In-Stock

1+ parts

$21.435

100+ parts

-

1k+ parts

$19.292

10k+ parts

-

1,956

$21.435

-

$19.292

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$23.254

100+ parts

$21.161

1k+ parts

$19.068

10k+ parts

-

450

$23.254

$21.161

$19.068

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MKK Technologies

India . 2,162 parts In-Stock

1+ parts

$40.307

100+ parts

-

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2,162

$40.307

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DigiPath Technology Company

USA . 2,162 parts In-Stock

1+ parts

$40.307

100+ parts

-

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2,162

$40.307

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Corphita

USA . 2,217 parts In-Stock

1+ parts

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2,217

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Perfect Parts

USA . 1,232 parts In-Stock

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1,232

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Parana Technologies

USA . 416 parts In-Stock

1+ parts

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100+ parts

$25.629

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416

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$25.629

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Overview

Elevate your power management solutions with the TSM1013AID from STMicroelectronics, a leader in innovation and quality. Engineered for reliability and efficiency, this compact IC supports a wide voltage range, ensuring optimal performance across diverse applications—from consumer electronics to industrial systems. With its robust design and premium materials, you gain peace of mind, knowing you're backed by a trusted manufacturer that prioritizes excellence. Experience unmatched value, enhanced functionality, and seamless integration today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making the IC suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, making the IC ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on the PCB and enables efficient layout design.

Nominal Supply Voltage (Vsup): 18 V

Operating at a nominal supply voltage of 18V provides a strong balance of performance and compatibility with various power systems.

Power Supplies (V): 18

With a regulated power supply of 18V, this product can efficiently handle a range of applications requiring stable voltage.

No. of Terminals: 8

Having 8 terminals allows for multiple connections, enhancing the integration capabilities with other circuit components.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables dense packaging, crucial for compact electronic circuits.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature allows the IC to be used in demanding environments without risking thermal failure.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this IC can function in various climates, widening its applicability.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent conductivity and resistance to corrosion, enhancing reliability over time.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in design and layout options for PCB integration.

Maximum Seated Height: 1.75 mm

A small seated height of 1.75 mm contributes to a low-profile design, suitable for space-constrained applications.

Width: 3.9 mm

The compact width allows for tighter layouts on the PCB, accommodating more components in a smaller area.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is essential for maintaining voltage stability and overall power management in electronic devices.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5V expands the versatility, making the IC compatible with a wider range of power sources.

Length: 4.9 mm

Its length of 4.9 mm supports flexible integration into various circuit designs without taking up excessive space.

Maximum Supply Current (Isup): 1 mA

With a maximum supply current of just 1 mA, this IC is energy-efficient, making it suitable for low-power applications.

Terminal Form: GULL WING

Gull-wing terminals facilitate easy soldering onto PCBs, enhancing manufacturing efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compactness and ease of handling in assembly processes.

Maximum Supply Voltage (Vsup): 28 V

Supporting a maximum supply voltage of 28V allows the IC to operate safely and reliably in high-voltage environments.

Technical Specifications

Power Management ICs TSM1013AID attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

18

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

18 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TSM1013AID Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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