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TSM1012ID

STMicroelectronics

TSM1012ID by STMicroelectronics

TSM1012ID by STMicroelectronics is a power management IC with an 18V nominal voltage, operating b/w -40 °C to 105 °C. It features an 8-terminal gull-wing package and supports applications in industrial power supply circuits. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$1.550

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,000 parts In-Stock

1+ parts

$1.170

100+ parts

$0.678

1k+ parts

$0.589

10k+ parts

$0.553

4,000

$1.170

$0.678

$0.589

$0.553

Mouser Electronics

USA . 1,925 parts In-Stock

1+ parts

$1.930

100+ parts

$1.160

1k+ parts

$1.020

10k+ parts

$0.939

1,925

$1.930

$1.160

$1.020

$0.939

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,793 parts In-Stock

1+ parts

$0.893

100+ parts

-

1k+ parts

-

10k+ parts

-

3,793

$0.893

-

-

-

Vyrian

USA . 4,605 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

-

4,605

$0.940

-

-

-

Anansix

USA . 2,168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,168

-

-

-

-

EMSNET

USA . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,700 parts In-Stock

1+ parts

$0.800

100+ parts

-

1k+ parts

-

10k+ parts

-

2,700

$0.800

-

-

-

Corphita

USA . 1,981 parts In-Stock

1+ parts

$0.846

100+ parts

-

1k+ parts

-

10k+ parts

-

1,981

$0.846

-

-

-

Vigor

Singapore . 2,000 parts In-Stock

1+ parts

$0.970

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$0.970

-

-

-

IDEA Electronic Components Group

UK . 763 parts In-Stock

1+ parts

$3.662

100+ parts

-

1k+ parts

$3.295

10k+ parts

-

763

$3.662

-

$3.295

-

MKK Technologies

India . 370 parts In-Stock

1+ parts

$6.885

100+ parts

-

1k+ parts

-

10k+ parts

-

370

$6.885

-

-

-

DigiPath Technology Company

USA . 370 parts In-Stock

1+ parts

$6.885

100+ parts

-

1k+ parts

-

10k+ parts

-

370

$6.885

-

-

-

Microchip USA

USA . 1,801 parts In-Stock

1+ parts

$8.246

100+ parts

-

1k+ parts

-

10k+ parts

-

1,801

$8.246

-

-

-

Perfect Parts

USA . 7,952 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,952

-

-

-

-

Kepictronics

USA . 4,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,400

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

iodParts Technologies Inc.

India . 2,495 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,495

-

-

-

-

Assy Fe

Spain . 1,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,990

-

-

-

-

Parana Technologies

USA . 481 parts In-Stock

1+ parts

-

100+ parts

$4.378

1k+ parts

-

10k+ parts

-

481

-

$4.378

-

-

Overview

Unlock the power of efficiency with the TSM1012ID from STMicroelectronics, a leader in innovation and reliability. Designed for robust power management applications, this compact IC ensures optimal performance under diverse conditions, boasting impressive temperature resilience from -40 °C to 105 °C. With its slim profile and dual terminals, it seamlessly integrates into your designs, delivering unmatched value and dependability for your projects. Elevate your solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight, durable package that is resistant to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs and enables automated assembly processes, reducing manufacturing costs and improving reliability.

Package Shape: SQUARE

The square package shape allows for easier placement and routing on PCBs, contributing to better design flexibility.

Nominal Supply Voltage (Vsup): 18 V

A nominal supply voltage of 18 V makes this IC ideal for a wide range of industrial applications that require stable power management.

Power Supplies (V): 18

The capability to handle 18 V power supplies indicates its robustness for high-power applications, enhancing its usability in demanding environments.

No. of Terminals: 8

The 8-terminal design offers a good balance of connectivity options without excessive complexity, making it easy to integrate into various circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile decrease the footprint on the PCB, allowing for designs where space is at a premium.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C ensures reliable performance in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operational capability down to -40 °C makes this IC excellent for harsh environments, ensuring reliability in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Premium terminal finish increases solderability and corrosion resistance, ensuring long-term reliability in various applications.

Terminal Position: DUAL

Dual terminal positioning facilitates easier routing and layout on PCBs, optimizing circuit design and connectivity.

Maximum Seated Height: 1.1 mm

The low seated height of 1.1 mm allows for a compact design, making it compatible with modern slim electronic devices.

Width: 3 mm

The 3 mm width contributes to the overall compactness of the design, ideal for space-constrained applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is specifically designed for efficient power management, crucial for modern electronic devices.

Minimum Supply Voltage (Vsup): 4.5 V

The capability to operate at a minimum of 4.5 V provides versatility for a range of applications, allowing it to work in low-power scenarios.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow time of 30 s ensures compatibility with standard soldering processes without risking damage to the IC.

Peak Reflow Temperature: 260 °C

With a peak reflow temperature tolerance of 260 °C, this IC can withstand high-temperature processes commonly used in modern PCB assembly.

Length: 3 mm

The 3 mm length aligns with its compact design, allowing optimal use of space within electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies its suitability for use in demanding environments, enhancing reliability and longevity.

Maximum Supply Current (Isup): 0.18 mA

A maximum supply current of 0.18 mA indicates low power consumption, making it energy-efficient and ideal for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form provides enhanced stability during soldering and improved PCB connectivity, ensuring a reliable electrical connection.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for denser PCB layouts while maintaining ease of assembly, a favored design in modern electronics.

Maximum Supply Voltage (Vsup): 28 V

The ability to handle up to 28 V supply voltage expands application possibilities, covering a broader range of industrial and consumer products.

Technical Specifications

Power Management ICs TSM1012ID attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

18

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.18 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

18 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TSM1012ID Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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