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TSM1012AIS

STMicroelectronics

TSM1012AIS by STMicroelectronics

TSM1012AIS by STMicroelectronics is a versatile power management IC designed for industrial applications. It operates within a supply voltage range of 4.5V to 28V and features an operating temp from -40 °C to 105 °C. With its compact SO8 package, it ensures efficient space utilization in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,253 parts In-Stock

1+ parts

-

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3,253

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Digiode

USA . 1,375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,375

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Anansix

USA . 292 parts In-Stock

1+ parts

-

100+ parts

-

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292

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 882 parts In-Stock

1+ parts

$6.860

100+ parts

-

1k+ parts

$6.174

10k+ parts

-

882

$6.860

-

$6.174

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MKK Technologies

India . 489 parts In-Stock

1+ parts

$12.901

100+ parts

-

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489

$12.901

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DigiPath Technology Company

USA . 489 parts In-Stock

1+ parts

$12.901

100+ parts

-

1k+ parts

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489

$12.901

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Corphita

USA . 1,489 parts In-Stock

1+ parts

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1,489

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Parana Technologies

USA . 157 parts In-Stock

1+ parts

-

100+ parts

$8.203

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157

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$8.203

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Overview

Unlock unmatched reliability with the TSM1012AIS from STMicroelectronics, a leader in power management solutions. This compact and robust IC is designed for diverse applications, delivering optimal performance even in extreme conditions. With its low power consumption and wide voltage range, it ensures efficiency and longevity in your devices. Trust in STMicroelectronics' commitment to quality and innovation, empowering you to elevate your projects while reducing time-to-market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures reliable performance and protection against environmental factors, making this IC suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of board space and simplifies the assembly process, enhancing design flexibility.

Package Shape: RECTANGULAR

The rectangular shape is optimal for space-saving designs, allowing easier integration into compact electronic systems.

Nominal Supply Voltage (Vsup): 18 V

An 18 V nominal supply voltage provides a robust operating range for various applications, supporting higher power requirements.

Power Supplies (V): 18

This specification indicates that the IC can efficiently manage power from a standard source, ensuring compatibility in most designs.

No. of Terminals: 8

With 8 terminals, this product offers multiple connections for flexible design configurations, enabling a wide range of functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances board density and reduces overall PCB size, beneficial for portable and space-constrained devices.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C ensures reliability and performance in demanding industrial and temperature-sensitive applications.

Minimum Operating Temperature: -40 °C

Operating effectively in temperatures as low as -40 °C makes this IC an excellent choice for outdoor and extreme environment applications.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options and design adaptability, facilitating easier integration into various layouts.

Maximum Seated Height: 1.75 mm

A low maximum seated height of 1.75 mm is advantageous in projects that require low-profile components for compact assemblies.

Width: 3.9 mm

The 3.9 mm width supports space-efficient designs and can fit into tighter layouts without compromising performance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is specifically designed to enhance power management, providing efficiency and reliability in various applications.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5 V allows for low-voltage operation, making it suitable for battery-powered and energy-efficient applications.

Length: 4.9 mm

Compact length of 4.9 mm allows for efficient board space utilization, fitting seamlessly into modern electronic designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies enhanced durability and reliability, perfect for harsh industrial environments.

Maximum Supply Current (Isup): 0.18 mA

A maximum supply current of 0.18 mA ensures that power consumption remains low, contributing to energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance thermal performance, aiding in manufacturing and assembly processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for easy spacing and handling during assembly, improving manufacturability and design flexibility.

Maximum Supply Voltage (Vsup): 28 V

With a maximum supply voltage of 28 V, this IC can handle elevated voltages, providing more versatility in varying power supply designs.

Technical Specifications

Power Management ICs TSM1012AIS attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

18

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.18 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

18 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TSM1012AIS Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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