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TSM1012IST

STMicroelectronics

TSM1012IST by STMicroelectronics

TSM1012IST by STMicroelectronics is a compact power management IC designed for industrial applications. It operates within a supply voltage range of 4.5V to 28V and features an operating temp from -40 °C to 105 °C. With its small outline and low current consumption of 0.18mA, it's ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,344 parts In-Stock

1+ parts

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4,344

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Vyrian

USA . 3,668 parts In-Stock

1+ parts

-

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-

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3,668

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Anansix

USA . 1,302 parts In-Stock

1+ parts

-

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1,302

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,159 parts In-Stock

1+ parts

$18.523

100+ parts

-

1k+ parts

$16.671

10k+ parts

-

2,159

$18.523

-

$16.671

-

AZTECH Wire

Italy . 205 parts In-Stock

1+ parts

$20.680

100+ parts

-

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10k+ parts

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205

$20.680

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MKK Technologies

India . 1,147 parts In-Stock

1+ parts

$34.832

100+ parts

-

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-

1,147

$34.832

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DigiPath Technology Company

USA . 1,147 parts In-Stock

1+ parts

$34.832

100+ parts

-

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10k+ parts

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1,147

$34.832

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Perfect Parts

USA . 21,553 parts In-Stock

1+ parts

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21,553

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Cyclops Electronics Ltd (Excess)

UK . 8,000 parts In-Stock

1+ parts

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8,000

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Corphita

USA . 4,680 parts In-Stock

1+ parts

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4,680

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Microchip USA

USA . 4,091 parts In-Stock

1+ parts

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4,091

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Vigor

Singapore . 2,440 parts In-Stock

1+ parts

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2,440

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Parana Technologies

USA . 1,335 parts In-Stock

1+ parts

-

100+ parts

$22.147

1k+ parts

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10k+ parts

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1,335

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$22.147

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Overview

Elevate your projects with the TSM1012IST from STMicroelectronics—a trusted leader in power management solutions. This compact and efficient IC is designed for reliability across diverse applications, operating seamlessly in industrial environments from -40 °C to 105 °C. Its superior quality ensures consistent performance, while its surface mount design simplifies integration. Experience enhanced power efficiency and precision that empowers your innovations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making the product reliable in various applications.

Surface Mount: YES

Being a surface mount device allows for easier integration into compact PCB designs, reducing space and improving manufacturing efficiency.

Package Shape: SQUARE

The square package shape facilitates easier layout on the PCB, providing options for organized component placement.

Nominal Supply Voltage (Vsup): 18 V

A nominal supply voltage of 18V supports a variety of application requirements, making it versatile for power management solutions.

Power Supplies (V): 18

Supporting an 18V power supply is suitable for many industrial applications, ensuring compatibility with common power sources.

No. of Terminals: 8

With 8 terminals, this IC provides sufficient connectivity for effective power management and control functions in a compact design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile allow for high-density PCB layouts, saving space without compromising performance.

Maximum Operating Temperature: 105 °C

The ability to operate at high temperatures (up to 105 °C) ensures reliability in demanding environments and extends the product's lifespan.

Minimum Operating Temperature: -40 °C

Operating from -40 °C highlights this product's suitability for extreme environments, such as outdoor or industrial applications.

Terminal Position: DUAL

Dual terminal position allows for flexible routing on PCB, enabling designers to optimize trace layout and improve performance.

Maximum Seated Height: 1.1 mm

A low seated height of 1.1 mm is conducive for low-profile applications, contributing to overall compact device design.

Width: 3 mm

At a width of 3 mm, this IC is suitable for space-constrained applications, promoting efficient use of board space.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it is specifically designed for enhancing power management, ensuring optimal performance in the field.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V allows operation in low-power scenarios, extending the range of applications.

Length: 3 mm

The compact length of 3 mm aids in design flexibility, allowing integration into small form factor devices.

Temperature Grade: INDUSTRIAL

Having an industrial temperature grade ensures the IC meets stringent reliability and performance requirements for industrial applications.

Maximum Supply Current (Isup): 0.18 mA

With a maximum supply current of only 0.18 mA, this IC is energy-efficient, minimizing power consumption in applications.

Terminal Form: GULL WING

Gull wing terminals ensure reliable soldering onto PCBs, promoting strong electrical connections and reducing the risk of failure.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for high-density configurations, enabling designs that conserve space while maintaining performance.

Maximum Supply Voltage (Vsup): 28 V

A maximum supply voltage of 28V provides flexibility for high-performance applications, making it suitable for a wider range of power management scenarios.

Technical Specifications

Power Management ICs TSM1012IST attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

18

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.18 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

18 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

TSM1012IST Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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