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TSM1014AIDT

STMicroelectronics

TSM1014AIDT by STMicroelectronics

TSM1014AIDT by STMicroelectronics is a versatile power management IC designed for industrial applications. It operates within a supply voltage range of 4.5V to 28V and features an operating temp from -40 °C to 105 °C. With its compact 8-terminal SO package, it ensures efficient performance in space-constrained designs.

Median Price

$1.530

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,130 parts In-Stock

1+ parts

$1.530

100+ parts

$0.900

1k+ parts

$0.787

10k+ parts

$0.733

4,130

$1.530

$0.900

$0.787

$0.733

DigiKey

USA . 2,730 parts In-Stock

1+ parts

$1.530

100+ parts

$0.899

1k+ parts

$0.786

10k+ parts

$0.732

2,730

$1.530

$0.899

$0.786

$0.732

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,467 parts In-Stock

1+ parts

$1.302

100+ parts

-

1k+ parts

-

10k+ parts

-

4,467

$1.302

-

-

-

Vyrian

USA . 1,252 parts In-Stock

1+ parts

$1.370

100+ parts

-

1k+ parts

-

10k+ parts

-

1,252

$1.370

-

-

-

Freddi Giovanni

Italy . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Bristol Electronics

USA . 2,254 parts In-Stock

1+ parts

-

100+ parts

$0.636

1k+ parts

$0.441

10k+ parts

-

2,254

-

$0.636

$0.441

-

Dan-Mar Components

USA . 2,254 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,254

-

-

-

-

Anansix

USA . 1,348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,348

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 958 parts In-Stock

1+ parts

$1.090

100+ parts

-

1k+ parts

-

10k+ parts

-

958

$1.090

-

-

-

Corphita

USA . 1,789 parts In-Stock

1+ parts

$1.233

100+ parts

-

1k+ parts

-

10k+ parts

-

1,789

$1.233

-

-

-

Component Stockers USA

USA . 4,867 parts In-Stock

1+ parts

$1.560

100+ parts

$1.090

1k+ parts

$0.710

10k+ parts

-

4,867

$1.560

$1.090

$0.710

-

Microchip USA

USA . 4,710 parts In-Stock

1+ parts

$4.691

100+ parts

-

1k+ parts

-

10k+ parts

-

4,710

$4.691

-

-

-

IDEA Electronic Components Group

UK . 1,085 parts In-Stock

1+ parts

$18.379

100+ parts

-

1k+ parts

$16.541

10k+ parts

-

1,085

$18.379

-

$16.541

-

Advanced Electronics

New Zealand . 92 parts In-Stock

1+ parts

$25.614

100+ parts

$23.309

1k+ parts

$21.003

10k+ parts

-

92

$25.614

$23.309

$21.003

-

MKK Technologies

India . 1,376 parts In-Stock

1+ parts

$34.560

100+ parts

-

1k+ parts

-

10k+ parts

-

1,376

$34.560

-

-

-

DigiPath Technology Company

USA . 1,376 parts In-Stock

1+ parts

$34.560

100+ parts

-

1k+ parts

-

10k+ parts

-

1,376

$34.560

-

-

-

Perfect Parts

USA . 36,518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

36,518

-

-

-

-

Assy Fe

Spain . 13,711 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,711

-

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Kepictronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Parana Technologies

USA . 2,351 parts In-Stock

1+ parts

-

100+ parts

$21.975

1k+ parts

-

10k+ parts

-

2,351

-

$21.975

-

-

iodParts Technologies Inc.

India . 1,351 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,351

-

-

-

-

Overview

Elevate your designs with the TSM1014AIDT from STMicroelectronics—where exceptional quality meets reliability in power management. Engineered for a wide range of industrial applications, this compact IC ensures optimal performance across varying temperatures. With ST's commitment to innovation and durability, you gain a robust solution that minimizes energy consumption while maximizing efficiency, empowering your projects for success in any environment. Experience the advantage!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability enables compact design and ease of integration into modern circuit boards, saving valuable space.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient use of space and aligns well with standard PCB layouts.

Nominal Supply Voltage (Vsup): 18 V

A nominal supply voltage of 18 V supports a wide range of applications, ensuring compatibility with diverse power sources.

No. of Terminals: 8

Having 8 terminals allows for sophisticated functionality while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style is designed for high-density applications, making it an excellent choice for space-constrained designs.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows this IC to function effectively in challenging environments, ensuring reliability.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes this IC suitable for extreme conditions, enhancing its versatility across applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent solderability and corrosion resistance, ensuring a reliable connection over time.

Terminal Position: DUAL

Dual terminal position enhances design flexibility, allowing for better routing options on the PCB.

Maximum Seated Height: 1.75 mm

A low seated height aids in maintaining a slim profile for space-sensitive applications while ensuring stability.

Width: 3.9 mm

At 3.9 mm in width, this IC is compact, making it ideal for small or densely packed circuit designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit indicates its capability to manage voltage and current effectively, crucial for system stability.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5 V allows for operation with low-voltage systems, enhancing its versatility.

Maximum Time At Peak Reflow Temperature: 30 s

Support for a maximum of 30 seconds at peak reflow temperature ensures compatibility with modern PCB assembly processes.

Peak Reflow Temperature: 260 °C

The ability to withstand high reflow temperatures makes this IC suitable for lead-free soldering processes, aligning with environmental standards.

Length: 4.9 mm

With a length of 4.9 mm, this IC fits well within compact applications, allowing for efficient use of PCB space.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates reliability in demanding environments, suitable for industrial applications.

Maximum Supply Current (Isup): 0.18 mA

A low maximum supply current of 0.18 mA makes this IC energy-efficient, ideal for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form enhances soldering performance and reliability, making assembly easier.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for easy routing and supports effective layout designs in modern PCBs.

Maximum Supply Voltage (Vsup): 28 V

The capability to handle a maximum supply voltage of 28 V provides ample headroom for various high-voltage applications.

Technical Specifications

Power Management ICs TSM1014AIDT attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

18

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.18 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

18 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TSM1014AIDT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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