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TSM1013AIST

STMicroelectronics

TSM1013AIST by STMicroelectronics

TSM1013AIST by STMicroelectronics is a compact power management IC with an 18V nominal voltage, operating b/w 4.5V and 28V. It features a small outline package with a max temp of 105 °C and supports dual terminal configurations. Ideal for efficient power supply applications in space-constrained designs.

Median Price

$0.736

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,901 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.736

3,901

-

-

-

$0.736

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,503 parts In-Stock

1+ parts

$0.717

100+ parts

-

1k+ parts

-

10k+ parts

-

4,503

$0.717

-

-

-

Digiode

USA . 3,542 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,542

-

-

-

-

Anansix

USA . 2,042 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,042

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,109 parts In-Stock

1+ parts

$1.610

100+ parts

-

1k+ parts

-

10k+ parts

-

2,109

$1.610

-

-

-

Microchip USA

USA . 187 parts In-Stock

1+ parts

$10.659

100+ parts

-

1k+ parts

-

10k+ parts

-

187

$10.659

-

-

-

IDEA Electronic Components Group

UK . 454 parts In-Stock

1+ parts

$11.507

100+ parts

-

1k+ parts

$10.357

10k+ parts

-

454

$11.507

-

$10.357

-

MKK Technologies

India . 1,797 parts In-Stock

1+ parts

$21.639

100+ parts

-

1k+ parts

-

10k+ parts

-

1,797

$21.639

-

-

-

DigiPath Technology Company

USA . 1,797 parts In-Stock

1+ parts

$21.639

100+ parts

-

1k+ parts

-

10k+ parts

-

1,797

$21.639

-

-

-

Modulus Dynamics

Lithuania . 5 parts In-Stock

1+ parts

$28.543

100+ parts

$28.543

1k+ parts

$28.543

10k+ parts

-

5

$28.543

$28.543

$28.543

-

Perfect Parts

USA . 22,201 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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22,201

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-

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Corphita

USA . 1,072 parts In-Stock

1+ parts

-

100+ parts

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1,072

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-

-

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Parana Technologies

USA . 930 parts In-Stock

1+ parts

-

100+ parts

$13.759

1k+ parts

-

10k+ parts

-

930

-

$13.759

-

-

Overview

Elevate your designs with the TSM1013AIST from STMicroelectronics, a leading name in power management solutions. This compact, surface-mount IC delivers exceptional efficiency and reliability for your electronic applications, from consumer gadgets to industrial equipment. With its robust temperature range and low power consumption, you can trust it to enhance performance while minimizing energy costs. Empower your projects with quality and innovation that STMicroelectronics is renowned for!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making it suitable for a wide range of applications.

Surface Mount: YES

Being a surface mount IC allows for easy integration into modern PCB designs, facilitating high-density layouts.

Package Shape: SQUARE

Square package shape optimizes board space and can enhance thermal performance.

Nominal Supply Voltage (Vsup): 18 V

The nominal supply voltage of 18 V is ideal for a variety of power management applications, providing robust performance.

Power Supplies (V): 18

Supports multiple power supplies at 18 V, allowing use in complex systems.

No. of Terminals: 8

With 8 terminals, it provides sufficient connections for various functions while maintaining a compact design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile enhance design flexibility in space-constrained applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliability in demanding environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows for use in low-temperature conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish aids in solderability, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position enhances connection stability and layout options.

Maximum Seated Height: 1.1 mm

The low seated height ensures compatibility with low-profile designs.

Width: 3 mm

A compact width of 3 mm is ideal for space-saving designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC supports power supply management, facilitating efficient energy distribution in applications.

Minimum Supply Voltage (Vsup): 4.5 V

The ability to operate down to 4.5 V allows for flexibility in power supply choices.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum time at peak reflow temperature of 30 s ensures compatibility with various surface mount soldering processes.

Peak Reflow Temperature: 260 °C

High peak reflow temperature tolerance makes it suitable for lead-free soldering.

Length: 3 mm

Having a length of 3 mm keeps the footprint small, contributing to overall PCB efficiency.

Maximum Supply Current (Isup): 1 mA

A low maximum supply current of 1 mA enhances energy efficiency, critical for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and ease of soldering.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density layouts while maintaining reliable connections.

Maximum Supply Voltage (Vsup): 28 V

The ability to handle up to 28 V makes this part suitable for applications requiring higher voltage levels.

Technical Specifications

Power Management ICs TSM1013AIST attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

18

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

18 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TSM1013AIST Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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