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TSM1013AIDT

STMicroelectronics

TSM1013AIDT by STMicroelectronics

TSM1013AIDT by STMicroelectronics is a versatile power management IC designed for applications requiring efficient voltage regulation. It operates within a supply voltage range of 4.5V to 28V and features an 8-terminal gull-wing package. With a max temp of 105 °C, it's ideal for compact electronic devices.

Median Price

$0.514

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,485 parts In-Stock

1+ parts

$0.514

100+ parts

-

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-

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2,485

$0.514

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Verical

USA . 2,485 parts In-Stock

1+ parts

-

100+ parts

$0.514

1k+ parts

-

10k+ parts

-

2,485

-

$0.514

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 879 parts In-Stock

1+ parts

$0.483

100+ parts

-

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879

$0.483

-

-

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Chip Stock

USA . 23,500 parts In-Stock

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23,500

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Vyrian

USA . 6,927 parts In-Stock

1+ parts

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6,927

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-

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Bristol Electronics

USA . 2,475 parts In-Stock

1+ parts

-

100+ parts

$0.394

1k+ parts

$0.294

10k+ parts

$0.273

2,475

-

$0.394

$0.294

$0.273

Microfarads

USA . 2,386 parts In-Stock

1+ parts

-

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2,386

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Anansix

USA . 1,251 parts In-Stock

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1,251

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ECAB

Sweden . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,051 parts In-Stock

1+ parts

$0.457

100+ parts

-

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-

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1,051

$0.457

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Component Stockers USA

USA . 3,382 parts In-Stock

1+ parts

$0.500

100+ parts

$0.500

1k+ parts

$0.500

10k+ parts

-

3,382

$0.500

$0.500

$0.500

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Vigor

Singapore . 1,877 parts In-Stock

1+ parts

$0.760

100+ parts

-

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1,877

$0.760

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Microchip USA

USA . 398 parts In-Stock

1+ parts

$6.146

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398

$6.146

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AZTECH Wire

Italy . 240 parts In-Stock

1+ parts

$9.050

100+ parts

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240

$9.050

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$18.218

100+ parts

$16.578

1k+ parts

$14.939

10k+ parts

-

5,000

$18.218

$16.578

$14.939

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IDEA Electronic Components Group

UK . 755 parts In-Stock

1+ parts

$18.740

100+ parts

-

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$16.866

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755

$18.740

-

$16.866

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MKK Technologies

India . 245 parts In-Stock

1+ parts

$35.240

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245

$35.240

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DigiPath Technology Company

USA . 245 parts In-Stock

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$35.240

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245

$35.240

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Authorized Procurement Solutions

USA . 8,500 parts In-Stock

1+ parts

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8,500

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A-Z Elektronik GmbH

Germany . 6,981 parts In-Stock

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6,981

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Kepictronics

USA . 5,496 parts In-Stock

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5,496

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Perfect Parts

USA . 3,460 parts In-Stock

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3,460

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Parana Technologies

USA . 2,091 parts In-Stock

1+ parts

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100+ parts

$22.407

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2,091

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$22.407

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Overview

Elevate your designs with the TSM1013AIDT from STMicroelectronics, a leader in power management solutions renowned for quality and innovation. This compact IC delivers exceptional efficiency and reliability across diverse applications, ensuring optimal performance in everything from consumer electronics to industrial controls. Experience seamless integration and lower energy consumption, empowering you to create smarter, more sustainable products that stand out in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material offers strong mechanical support and protects the IC from environmental factors, ensuring reliability.

Surface Mount: YES

Surface mount technology allows for easier and quicker assembly on circuit boards, making manufacturing more efficient.

Package Shape: RECTANGULAR

The rectangular package shape simplifies PCB layout and maximizes space utilization, enabling compact designs.

Nominal Supply Voltage (Vsup): 18 V

With a nominal supply voltage of 18 V, this IC is well-suited for a variety of power management applications.

Power Supplies (V): 18

Designed for operation at 18 V, this IC ensures compatibility with standard power supply configurations.

No. of Terminals: 8

The 8-terminal configuration provides sufficient connectivity for various functions while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style supports high-density applications, ideal for modern electronics.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105 °C, this IC can operate in high-temperature environments, which is crucial for reliability.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures stable performance in a wide range of climates and applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and enhances solderability, improving long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for flexibility in PCB design, making it easier to integrate into diverse layouts.

Maximum Seated Height: 1.75 mm

A low maximum seated height of 1.75 mm helps in maintaining compact designs and minimizes the overall profile of the circuit.

Width: 3.9 mm

The narrow width of 3.9 mm is advantageous for space-constrained applications, facilitating higher density placement.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it serves critical roles in voltage regulation, making it essential for power management.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V broadens its usability, allowing it to function in varied electronic systems.

Length: 4.9 mm

The compact length of 4.9 mm enhances the versatility of the IC in dense electronic assemblies.

Maximum Supply Current (Isup): 1 mA

A low maximum supply current of 1 mA contributes to energy efficiency, essential for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals improve soldering connections on PCBs, making assembly more reliable and reducing potential defects.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compactness and ease of handling, facilitating automated assembly processes.

Maximum Supply Voltage (Vsup): 28 V

With a maximum supply voltage of 28 V, the IC accommodates a wide range of applications, providing flexibility in various power management scenarios.

Technical Specifications

Power Management ICs TSM1013AIDT attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

18

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

18 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TSM1013AIDT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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