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TSM1014AID

STMicroelectronics

TSM1014AID by STMicroelectronics

TSM1014AID by STMicroelectronics is a versatile power management IC with an 18V nominal voltage, operating b/w -40 °C to 105 °C. It features an 8-terminal gull-wing package and supports industrial applications. Ideal for compact designs, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,493 parts In-Stock

1+ parts

-

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5,493

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Digiode

USA . 3,826 parts In-Stock

1+ parts

-

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3,826

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Bristol Electronics

USA . 1,940 parts In-Stock

1+ parts

-

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1,940

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Dan-Mar Components

USA . 1,940 parts In-Stock

1+ parts

-

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-

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1,940

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Anansix

USA . 539 parts In-Stock

1+ parts

-

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539

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,157 parts In-Stock

1+ parts

$0.750

100+ parts

-

1k+ parts

-

10k+ parts

-

2,157

$0.750

-

-

-

IDEA Electronic Components Group

UK . 1,336 parts In-Stock

1+ parts

$3.157

100+ parts

-

1k+ parts

$2.841

10k+ parts

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1,336

$3.157

-

$2.841

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Ampacity Inc.

Singapore . 1,560 parts In-Stock

1+ parts

$5.500

100+ parts

-

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1,560

$5.500

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-

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Microchip USA

USA . 3,667 parts In-Stock

1+ parts

$5.563

100+ parts

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3,667

$5.563

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MKK Technologies

India . 2,195 parts In-Stock

1+ parts

$5.936

100+ parts

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2,195

$5.936

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DigiPath Technology Company

USA . 2,195 parts In-Stock

1+ parts

$5.936

100+ parts

-

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2,195

$5.936

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AZTECH Wire

Italy . 609 parts In-Stock

1+ parts

$8.410

100+ parts

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609

$8.410

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Parana Technologies

USA . 1,854 parts In-Stock

1+ parts

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100+ parts

$3.774

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1,854

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$3.774

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Corphita

USA . 759 parts In-Stock

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759

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Kepictronics

USA . 165 parts In-Stock

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165

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Overview

Unlock unparalleled performance with the TSM1014AID from STMicroelectronics, a leader in innovative power management solutions. Designed to optimize efficiency while ensuring durability across demanding applications, this compact IC thrives under extreme temperatures and provides robust support for your power supply needs. Choosing TSM1014AID means investing in reliability and superior quality, empowering your projects with a seamless and dependable energy management experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and reliability, making the IC suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB, promoting efficient layout and design.

Nominal Supply Voltage (Vsup): 18 V

The nominal supply voltage enables operation in standard power applications, ensuring compatibility with common circuits.

Power Supplies (V): 18

Supports a standard power supply voltage, providing versatility in system integration.

No. of Terminals: 8

With 8 terminals, it offers a compact yet functional design, allowing for multiple connections in a small footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes PCB space requirements, making it ideal for space-constrained designs.

Maximum Operating Temperature: 105 °C

High-temperature tolerance ensures reliable performance in demanding environments.

Minimum Operating Temperature: -40 °C

Withstand extreme low temperatures, the IC is suitable for industrial applications in harsh climates.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and ensures long-term reliability of connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible design options, facilitating easier PCB layout.

Maximum Seated Height: 1.75 mm

The low seated height promotes an ultra-compact design, allowing for denser circuit layouts.

Width: 3.9 mm

This narrow width is beneficial for applications where space is at a premium.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it is essential for efficient power management in electronic devices.

Minimum Supply Voltage (Vsup): 4.5 V

The capability to operate at a minimum of 4.5 V enhances compatibility with lower voltage systems.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures minimal thermal stress during soldering, enhancing reliability.

Peak Reflow Temperature °C: 260

Supporting high reflow temperatures allows this IC to withstand modern SMT soldering processes.

Length: 4.9 mm

With a compact length, the IC fits well into small form factor devices, ensuring efficient use of space.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates robustness for harsh environments, suitable for industrial applications.

Maximum Supply Current (Isup): 0.18 mA

Low supply current enhances power efficiency and extends battery life in portable applications.

Terminal Form: GULL WING

Gull wing terminals provide streamlined soldering and better mechanical stability on PCBs.

Terminal Pitch: 1.27 mm

The standard terminal pitch facilitates easy integration with existing PCB designs and manufacturing processes.

Maximum Supply Voltage (Vsup): 28 V

With a maximum supply voltage of 28 V, this IC can handle a wide range of power applications safely.

Technical Specifications

Power Management ICs TSM1014AID attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

18

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.18 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

18 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TSM1014AID Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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