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TPS3307-18DGNRG4

Texas Instruments

TPS3307-18DGNRG4 by Texas Instruments

TPS3307-18DGNRG4 by Texas Instruments is a power management IC with a nominal voltage of 3.3V and max operating temperature of 85°C. It is used as a power supply support circuit in industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 8,215 parts In-Stock

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8,215

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Vyrian

USA . 4,121 parts In-Stock

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4,121

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Digiode

USA . 837 parts In-Stock

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837

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,627 parts In-Stock

1+ parts

$0.500

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1,627

$0.500

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One Stop Electronics

USA . 311 parts In-Stock

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$0.500

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311

$0.500

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Semicontronic

India . 304 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

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$2.425

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304

$2.500

$2.438

$2.425

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AZTECH Wire

Italy . 275 parts In-Stock

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$8.679

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275

$8.679

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Corohmni

South Africa . 692 parts In-Stock

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$8.763

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692

$8.763

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Parana Technologies

USA . 999 parts In-Stock

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$14.244

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$14.694

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999

$14.244

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$14.694

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DigiPath Technology Company

USA . 425 parts In-Stock

1+ parts

$15.684

100+ parts

$14.429

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425

$15.684

$14.429

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ChromeModa Solutions

Germany . 3,323 parts In-Stock

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$16.004

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$13.123

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3,323

$16.004

$13.123

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IDEA Electronic Components Group

UK . 2,276 parts In-Stock

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$16.004

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$15.204

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$14.404

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2,276

$16.004

$15.204

$14.404

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$16.661

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$15.828

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$15.828

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2,500

$16.661

$15.828

$15.828

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A-Z Elektronik GmbH

Germany . 6,999 parts In-Stock

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Continental Prestige Electronics

USA . 6,175 parts In-Stock

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Microchip USA

USA . 4,981 parts In-Stock

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4,981

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Argo Parts USA

USA . 4,040 parts In-Stock

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Kepictronics

USA . 4,000 parts In-Stock

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4,000

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Corphita

USA . 2,654 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Experience unrivaled power management with the TPS3307-18DGNRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you a product that exceeds expectations. This power management IC offers versatile applications, ensuring optimal performance in various settings. With its small outline and thin profile package style, it seamlessly integrates into your system. Benefit from its adjustable threshold feature, allowing you to customize voltage levels to suit your specific needs. Trust in the reliability and efficiency of the TPS3307-18DGNRG4 for all your power management requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Optimal supply voltage for the power management IC, ensuring stable and efficient operation.

No. of Terminals: 8

Provides flexibility and compatibility with various circuit configurations.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat generation is common.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, making it versatile for different environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Offers excellent conductivity and corrosion resistance for reliable performance over time.

No. of Channels: 3

Provides multiple channels for power distribution or monitoring, allowing for more versatile use in various applications.

Technical Specifications

Power Management ICs TPS3307-18DGNRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.93V; MANUAL RESET INPUT; POWER-ON RESET GENERATOR

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.25,1.68,2.93V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS3307-18DGNRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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