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T835-700T

STMicroelectronics

T835-700T by STMicroelectronics

STMicroelectronics T835-700T is a snubberless TRIAC with 8A max RMS on-state current and 700V repetitive peak off-state voltage. It has a max DC gate trigger current of 35mA, suitable for AC power control applications in temperatures ranging from -40 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,670 parts In-Stock

1+ parts

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4,670

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Anansix

USA . 1,486 parts In-Stock

1+ parts

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1k+ parts

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1,486

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Digiode

USA . 899 parts In-Stock

1+ parts

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899

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 307 parts In-Stock

1+ parts

$3.118

100+ parts

-

1k+ parts

$2.806

10k+ parts

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307

$3.118

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$2.806

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MKK Technologies

India . 1,759 parts In-Stock

1+ parts

$5.863

100+ parts

-

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10k+ parts

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1,759

$5.863

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DigiPath Technology Company

USA . 1,759 parts In-Stock

1+ parts

$5.863

100+ parts

-

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1,759

$5.863

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Corphita

USA . 4,761 parts In-Stock

1+ parts

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4,761

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Parana Technologies

USA . 395 parts In-Stock

1+ parts

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100+ parts

$3.728

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395

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$3.728

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Overview

Unleash the power of seamless control with the T835-700T by STMicroelectronics. Crafted with precision and excellence, this TRIAC offers unparalleled reliability and performance. Whether you're looking to enhance lighting systems, motor speed controls, or heating applications, this device is your go-to solution. Embrace the future of technology with a product that guarantees quality, efficiency, and innovation. Upgrade your projects with the T835-700T and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and thermal properties, making the TRIAC durable and efficient in various applications.

Maximum DC Gate Trigger Current: 35 mA

With a relatively low trigger current, this TRIAC can be easily controlled and activated, leading to precise performance in AC circuits.

Configuration: SINGLE

The single configuration simplifies the circuit design and enhances the reliability of the TRIAC by having fewer components to manage.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and installation in electronic circuits, optimizing space utilization.

Terminal Form: THROUGH-HOLE

The through-hole terminals offer stable and secure connections, ensuring consistent performance and ease of soldering during assembly.

No. of Terminals: 3

Having three terminals enables efficient control and integration within circuit designs, enhancing the versatility of the TRIAC.

Package Style (Meter): FLANGE MOUNT

The flange mount style provides mechanical stability and easy mounting options, making it suitable for various industrial applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this TRIAC can withstand demanding environmental conditions and ensure stable performance in challenging situations.

Trigger Device Type: SNUBBERLESS TRIAC

The snubberless design reduces electrical noise and interference, improving the overall reliability and performance of the TRIAC in AC circuits.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the TRIAC to function reliably in cold environments, expanding its usability in a wide range of applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish ensures good solderability and corrosion resistance, maintaining stable electrical connections over time for consistent performance.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and connection, reducing the risk of errors and facilitating efficient circuit integration.

Maximum RMS On-state Current: 8 A

With a high maximum RMS on-state current, this TRIAC can handle significant power loads and deliver reliable performance in demanding applications.

Repetitive Peak Off-state Voltage: 700 V

The high repetitive peak off-state voltage ensures safe and stable operation, allowing the TRIAC to withstand voltage spikes and surges in the circuit.

Technical Specifications

Triode For Alternating Current (TRIAC) T835-700T attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Maximum DC Gate Trigger Current:

35 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Repetitive Peak Off-state Voltage:

700 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T835-700T Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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