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T835-400T

STMicroelectronics

T835-400T by STMicroelectronics

STMicroelectronics T835-400T is a 3-terminal TRIAC with max. RMS current of 8A and repetitive peak off-state voltage of 400V. It operates b/w -40 °C to 125°C, ideal for AC power control applications requiring a snubberless TRIAC configuration in a plastic/epoxy package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,957 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

4,957

-

-

-

-

Digiode

USA . 3,964 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,964

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-

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Anansix

USA . 2,894 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,894

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,650 parts In-Stock

1+ parts

$3.665

100+ parts

-

1k+ parts

$3.299

10k+ parts

-

1,650

$3.665

-

$3.299

-

MKK Technologies

India . 260 parts In-Stock

1+ parts

$6.892

100+ parts

-

1k+ parts

-

10k+ parts

-

260

$6.892

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-

-

DigiPath Technology Company

USA . 260 parts In-Stock

1+ parts

$6.892

100+ parts

-

1k+ parts

-

10k+ parts

-

260

$6.892

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-

-

Parana Technologies

USA . 1,321 parts In-Stock

1+ parts

-

100+ parts

$4.382

1k+ parts

-

10k+ parts

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1,321

-

$4.382

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Corphita

USA . 1,266 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,266

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Overview

The T835-400T by STMicroelectronics is a top-of-the-line TRIAC that offers unmatched quality and reliability. With a reputation for excellence in manufacturing, STMicroelectronics ensures that this product meets the highest standards for performance and durability. Ideal for a wide range of applications, this TRIAC provides customers with the value and benefits they need, delivering seamless operation and consistent results. Upgrade your electronics with the T835-400T and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as package body material makes the product lightweight and durable, which is ideal for electronic applications.

Maximum DC Gate Trigger Current: 35 mA

The high maximum DC gate trigger current ensures reliable and efficient triggering of the TRIAC, making it suitable for a wide range of applications.

Configuration: SINGLE

The single configuration simplifies the design and integration of the TRIAC into electronic circuits, making it user-friendly.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and installation, making it convenient for manufacturers and users.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure and stable connection, improving the overall performance and reliability of the product.

No. of Terminals: 3

Having 3 terminals allows for easy and efficient connection in electronic circuits, enhancing the usability of the product.

Package Style (Meter): FLANGE MOUNT

The flange mount package style ensures easy and secure mounting, making it suitable for diverse industrial applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the TRIAC can withstand harsh environmental conditions, improving its reliability in various applications.

Trigger Device Type: SNUBBERLESS TRIAC

The snubberless TRIAC type offers improved switching performance and efficiency, making it a preferred choice for demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the TRIAC to function effectively in extreme cold conditions, expanding its usability.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides a reliable and corrosion-resistant connection, ensuring long-term performance and durability of the product.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation process and ensures proper alignment, making it user-friendly.

Maximum RMS On-state Current: 8 A

With a high maximum RMS on-state current, the TRIAC can handle heavy loads and high currents, making it suitable for power control applications.

Repetitive Peak Off-state Voltage: 400 V

The high repetitive peak off-state voltage rating ensures safe and reliable operation, making it suitable for high voltage applications.

Technical Specifications

Triode For Alternating Current (TRIAC) T835-400T attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Maximum DC Gate Trigger Current:

35 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T835-400T Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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