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T835-600D

STMicroelectronics

T835-600D by STMicroelectronics

STMicroelectronics T835-600D is a 3-terminal TRIAC with max. DC gate trigger current of 35mA and max. RMS on-state current of 8A. It operates b/w -40 °C to 125°C, suitable for snubberless TRIAC applications in AC circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,415 parts In-Stock

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4,415

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Vyrian

USA . 2,988 parts In-Stock

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2,988

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Anansix

USA . 1,561 parts In-Stock

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1,561

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,186 parts In-Stock

1+ parts

$3.437

100+ parts

-

1k+ parts

$3.093

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2,186

$3.437

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$3.093

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MKK Technologies

India . 1,468 parts In-Stock

1+ parts

$6.463

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1,468

$6.463

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DigiPath Technology Company

USA . 1,468 parts In-Stock

1+ parts

$6.463

100+ parts

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1,468

$6.463

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Corphita

USA . 2,803 parts In-Stock

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2,803

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Parana Technologies

USA . 747 parts In-Stock

1+ parts

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100+ parts

$4.110

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747

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$4.110

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Overview

Upgrade your electronics with the T835-600D from STMicroelectronics, a top-of-the-line Triode For Alternating Current (TRIAC) that offers exceptional quality and reliability. Designed with a snubberless TRIAC configuration, this product provides seamless performance and superior energy efficiency for a wide range of applications. Whether you're looking to enhance the functionality of your home appliances or optimize industrial equipment, the T835-600D delivers unmatched value, benefits, and advantages to meet your needs. Trust in STMicroelectronics for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the TRIAC, ensuring long-lasting performance.

Maximum DC Gate Trigger Current: 35 mA

With a maximum DC gate trigger current of 35 mA, this TRIAC can easily be controlled and triggered to switch on and off, making it suitable for a wide range of applications.

Configuration: SINGLE

The single configuration simplifies the wiring and installation process, making it more convenient for users to set up and use the TRIAC in their systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and placement of the TRIAC in different applications, providing flexibility in design and integration.

Terminal Form: THROUGH-HOLE

The through-hole terminal form makes it easy to solder and secure the TRIAC onto a circuit board, ensuring a reliable connection and efficient operation.

No. of Terminals: 3

Having 3 terminals enables the TRIAC to be easily connected to external circuits and devices, offering versatility and compatibility for various system configurations.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure and stable mounting of the TRIAC, ensuring proper heat dissipation and overall performance in demanding environments.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this TRIAC can withstand high heat conditions and maintain stable performance, making it suitable for industrial applications.

Trigger Device Type: SNUBBERLESS TRIAC

The snubberless design of this TRIAC helps to reduce electromagnetic interference and improve efficiency in switching operations, making it a reliable choice for precision control.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range of -40 °C ensures that this TRIAC can function effectively in extreme cold environments, expanding its potential applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent conductivity and solderability, ensuring a secure and reliable connection for the TRIAC in various operating conditions.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation and connection process, making it easier for users to integrate the TRIAC into their systems with minimal effort.

Maximum RMS On-state Current: 8 A

With a maximum RMS on-state current of 8 A, this TRIAC can handle high current loads with ease, making it suitable for power control applications that require robust performance.

Repetitive Peak Off-state Voltage: 600 V

The high repetitive peak off-state voltage of 600 V ensures that this TRIAC can withstand voltage spikes and transients, offering reliable protection for connected devices and circuits.

Technical Specifications

Triode For Alternating Current (TRIAC) T835-600D attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Maximum DC Gate Trigger Current:

35 mA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T835-600D Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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