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T405-400B

STMicroelectronics

T405-400B by STMicroelectronics

STMicroelectronics T405-400B is a single TRIAC with 4A RMS on-state current and 400V repetitive peak off-state voltage. Ideal for 4-quadrant logic level triggering applications, it has a max DC gate trigger current of 5mA. With a temperature range from -40 °C to 110°C, this surface-mount device is suitable for various AC control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Connector Distribution Corp

USA . 2,023 parts In-Stock

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2,023

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Right Parts Inc.

USA . 2,023 parts In-Stock

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2,023

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Vyrian

USA . 1,455 parts In-Stock

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1,455

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Digiode

USA . 985 parts In-Stock

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985

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Anansix

USA . 238 parts In-Stock

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238

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 828 parts In-Stock

1+ parts

$3.099

100+ parts

-

1k+ parts

$2.789

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828

$3.099

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$2.789

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MKK Technologies

India . 1,099 parts In-Stock

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$5.827

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1,099

$5.827

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DigiPath Technology Company

USA . 1,099 parts In-Stock

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$5.827

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1,099

$5.827

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Corphita

USA . 2,990 parts In-Stock

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2,990

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Parana Technologies

USA . 680 parts In-Stock

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$3.705

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680

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$3.705

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Overview

Unlock the power of the T405-400B by STMicroelectronics, a top-quality TRIAC designed for a wide range of applications. With a focus on reliability and performance, STMicroelectronics delivers a product that exceeds expectations. From lighting control to motor speed regulation, this TRIAC offers customers unmatched value and benefits. Trust in STMicroelectronics to provide you with the quality and innovation needed to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it easy to handle and resistant to damage.

Maximum DC Gate Trigger Current: 5 mA

The low gate trigger current requirement allows for efficient and precise control of the device, making it suitable for a wide range of applications.

Configuration: SINGLE

The single configuration simplifies the design and installation process, making it more user-friendly and easier to integrate.

Surface Mount: YES

Being surface mountable allows for easier PCB assembly and space-saving benefits, making it ideal for compact electronic designs.

Package Shape: RECTANGULAR

The rectangular shape provides a standard form factor for easy handling and integration into existing systems or designs.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable connections, reducing the risk of loose connections or malfunctions.

Maximum Leakage Current: 0.01 mA

The low leakage current ensures minimal power loss and improved efficiency in operation, making it a cost-effective choice.

No. of Terminals: 2

Having only two terminals simplifies the wiring process and reduces the chance of errors when connecting the device.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for more components to be integrated, making it suitable for compact designs.

Maximum Operating Temperature: 110 °C

With a high maximum operating temperature, the device can withstand harsh environments and maintain stable performance under extreme conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The use of 4 quadrant logic level TRIAC ensures precise control and reliable performance in a variety of operating conditions, making it versatile and adaptable.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the device to function reliably in cold environments, enhancing its usability in a wide range of applications.

Terminal Finish: MATTE TIN

The matte tin finish provides good conductivity and corrosion resistance, ensuring long-term reliability and performance of the device.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and reduces the likelihood of errors during assembly, making it user-friendly and efficient.

Maximum RMS On-state Current: 4 A

The high maximum RMS on-state current rating allows the device to handle heavy loads and high power applications with ease, enhancing its versatility.

Maximum DC Gate Trigger Voltage: 1.5 V

The low gate trigger voltage requirement ensures efficient control and operation of the device, reducing power consumption and improving overall performance.

Case Connection: MAIN TERMINAL 2

The case connection at main terminal 2 provides a secure and stable connection point, ensuring reliable performance and consistent operation.

Repetitive Peak Off-state Voltage: 400 V

The high repetitive peak off-state voltage rating allows the device to withstand high voltage spikes and surges, ensuring reliable operation in demanding environments.

Minimum Critical Rate of Rise of Off-state Voltage: 5 V/us

The minimum critical rate of rise of off-state voltage ensures fast and reliable switching, reducing the risk of malfunctions and improving overall performance.

Maximum Holding Current: 10 mA

The maximum holding current rating allows the device to maintain conduction even after the gate trigger current is removed, ensuring stable operation and preventing unintended switching off.

Technical Specifications

Triode For Alternating Current (TRIAC) T405-400B attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

5 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

10 mA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Maximum Leakage Current:

.01 mA

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

T405-400B Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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