Loading...

T405-700B

STMicroelectronics

T405-700B by STMicroelectronics

T405-700B by STMicroelectronics is a single TRIAC designed for AC applications, featuring a max RMS on-state current of 4A and repetitive peak off-state voltage of 700V. It operates efficiently in temperatures from -40 °C to 125°C. Ideal for controlling loads in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,584

-

-

-

-

Digiode

USA . 2,460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,460

-

-

-

-

Anansix

USA . 1,087 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,087

-

-

-

-

ComSIT Distribution GmbH

Germany . 364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

364

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 616 parts In-Stock

1+ parts

$3.354

100+ parts

-

1k+ parts

$3.019

10k+ parts

-

616

$3.354

-

$3.019

-

MKK Technologies

India . 1,269 parts In-Stock

1+ parts

$6.308

100+ parts

-

1k+ parts

-

10k+ parts

-

1,269

$6.308

-

-

-

DigiPath Technology Company

USA . 1,269 parts In-Stock

1+ parts

$6.308

100+ parts

-

1k+ parts

-

10k+ parts

-

1,269

$6.308

-

-

-

Parana Technologies

USA . 2,043 parts In-Stock

1+ parts

-

100+ parts

$4.011

1k+ parts

-

10k+ parts

-

2,043

-

$4.011

-

-

Corphita

USA . 1,653 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,653

-

-

-

-

Kepictronics

USA . 460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

460

-

-

-

-

Overview

Unlock the power of efficiency with the T405-700B TRIAC from STMicroelectronics, a leader in semiconductor innovation. This high-performance device excels in controlling AC loads while ensuring minimal leakage current and robust thermal stability. Ideal for a wide range of applications, from lighting controls to motor drives, its compact design and reliable operation empower engineers to create smarter, more efficient systems. Elevate your projects with the quality assurance and expertise that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy helps in ensuring the robustness of the package, making it suitable for various applications.

Maximum DC Gate Trigger Current: 5 mA

A low gate trigger current requirement allows for easy interfacing with microcontrollers and reduces energy consumption.

Configuration: SINGLE

Single configuration simplifies circuit design and is often sufficient for many applications, aiding in compact designs.

Surface Mount: YES

Surface mount capability enables efficient use of PCB space and is essential for modern electronic designs.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on PCBs.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical and electrical connections, making them reliable for soldering.

Maximum Leakage Current: 0.005 mA

Low leakage current helps in minimizing power loss and ensures greater energy efficiency in applications.

No. of Terminals: 2

Having only two terminals simplifies the design and integration into circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability and durability in harsh environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Being a logic level TRIAC, it can be easily driven by low voltage digital circuits, making it versatile for various applications.

Minimum Operating Temperature: -40 °C

A wide temperature range makes this TRIAC suitable for both extremely hot and cold environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish offers good solderability and resistance to corrosion.

Terminal Position: SINGLE

Single terminal position aids in simple and straightforward layout designs.

Maximum RMS On-state Current: 4 A

A maximum on-state current of 4 A provides flexibility for usage in various load conditions.

Maximum DC Gate Trigger Voltage: 1.3 V

A low gate trigger voltage allows for easier circuit interfacing and enhances overall efficiency.

Case Connection: MAIN TERMINAL 2

Having a clear main terminal connection reduces complexity in wiring and installation.

Repetitive Peak Off-state Voltage: 700 V

The high peak off-state voltage indicates suitability for high-voltage applications, enhancing its versatility.

Minimum Critical Rate of Rise of Off-state Voltage: 20 V/us

This specification ensures reliable operation in rapid switching applications, making it suitable for fast-response systems.

Maximum Holding Current: 10 mA

A low maximum holding current allows for stable operation in low-power applications, improving energy efficiency.

Maximum Time At Peak Reflow Temperature: 30 s

A longer time at peak reflow temperature allows for better soldering processes in manufacturing.

Peak Reflow Temperature: 260 °C

High peak reflow temperature indicates compatibility with modern soldering techniques, enhancing manufacturing robustness.

Technical Specifications

Triode For Alternating Current (TRIAC) T405-700B attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

20 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

10 mA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Maximum Leakage Current:

.005 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

700 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

Trade Compliance

T405-700B Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19