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T405-400K

STMicroelectronics

T405-400K by STMicroelectronics

STMicroelectronics T405-400K is a TRIAC with 4A RMS on-state current, 400V repetitive peak off-state voltage, and 5mA max DC gate trigger current. It's used in AC power control applications due to its single configuration and gull wing terminals for surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,181 parts In-Stock

1+ parts

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100+ parts

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4,181

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Anansix

USA . 702 parts In-Stock

1+ parts

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1k+ parts

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702

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Digiode

USA . 551 parts In-Stock

1+ parts

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551

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,044 parts In-Stock

1+ parts

$3.386

100+ parts

-

1k+ parts

$3.047

10k+ parts

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1,044

$3.386

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$3.047

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MKK Technologies

India . 1,895 parts In-Stock

1+ parts

$6.366

100+ parts

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1,895

$6.366

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DigiPath Technology Company

USA . 1,895 parts In-Stock

1+ parts

$6.366

100+ parts

-

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10k+ parts

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1,895

$6.366

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Parana Technologies

USA . 1,788 parts In-Stock

1+ parts

-

100+ parts

$4.048

1k+ parts

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1,788

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$4.048

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Corphita

USA . 603 parts In-Stock

1+ parts

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603

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Overview

Enhance your electronic projects with the T405-400K by STMicroelectronics, a high-quality TRIAC component designed for seamless AC power control. With a reputation for excellence in manufacturing, STMicroelectronics delivers reliability and performance, making this TRIAC ideal for various applications. From lighting dimmers to motor speed control, this versatile component offers value, benefits, and advantages that will elevate your designs. Trust STMicroelectronics to provide innovative solutions for your electrical needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, making it suitable for various applications.

Maximum DC Gate Trigger Current: 5 mA

Low gate trigger current ensures efficient and precise control of the TRIAC, improving overall performance and reliability.

Configuration: SINGLE

Single configuration simplifies installation and integration, making it convenient for users.

Surface Mount: YES

Surface mount capability allows for easy PCB installation, saving space and making it suitable for compact designs.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor for easy compatibility with existing systems and applications.

Terminal Form: GULL WING

Gull wing terminals offer secure and reliable connections, ensuring stable performance in various operating conditions.

No. of Terminals: 3

Three terminals provide the necessary connections for proper operation and control of the TRIAC, simplifying wiring and setup.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for easy mounting and installation, ensuring stability and durability in different environments.

Maximum Operating Temperature: 110 °C

High maximum operating temperature ensures reliable performance even in demanding industrial and commercial applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the TRIAC to function in extreme cold environments, expanding its range of applications.

Trigger Device Type: TRIAC

TRIAC trigger device type offers precise and efficient control over alternating current, making it ideal for various power control applications.

Maximum RMS On-state Current: 4 A

High maximum RMS on-state current capacity allows the TRIAC to handle heavy loads and provide consistent performance under high current conditions.

Repetitive Peak Off-state Voltage: 400 V

High repetitive peak off-state voltage rating ensures the TRIAC can safely operate within specified voltage limits, enhancing its reliability and longevity.

Maximum Holding Current: 15 mA

Maximum holding current rating indicates the minimum current required to maintain the on-state condition, ensuring stable operation and preventing false triggering.

Technical Specifications

Triode For Alternating Current (TRIAC) T405-400K attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Maximum DC Gate Trigger Current:

5 mA

Maximum Holding Current:

15 mA

JESD-30 Code:

R-PSFM-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

T405-400K Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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