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STW8N80

STMicroelectronics

STW8N80 by STMicroelectronics

STW8N80 by STMicroelectronics is an N-channel FET designed for switching applications, featuring a max drain current of 8.2 A and a breakdown voltage of 800 V. It operates in enhancement mode with a power dissipation of up to 180 W. Ideal for high-voltage circuits, it ensures efficient performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,374 parts In-Stock

1+ parts

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4,374

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Vyrian

USA . 3,676 parts In-Stock

1+ parts

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3,676

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Anansix

USA . 2,460 parts In-Stock

1+ parts

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2,460

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,180 parts In-Stock

1+ parts

$1.777

100+ parts

-

1k+ parts

$1.599

10k+ parts

-

2,180

$1.777

-

$1.599

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MKK Technologies

India . 191 parts In-Stock

1+ parts

$3.341

100+ parts

-

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191

$3.341

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DigiPath Technology Company

USA . 191 parts In-Stock

1+ parts

$3.341

100+ parts

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191

$3.341

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Kepictronics

USA . 3,500 parts In-Stock

1+ parts

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3,500

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Parana Technologies

USA . 1,098 parts In-Stock

1+ parts

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100+ parts

$2.124

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1,098

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$2.124

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Corphita

USA . 925 parts In-Stock

1+ parts

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925

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Overview

Unlock unparalleled efficiency with the STW8N80 from STMicroelectronics, a trusted leader in semiconductor innovation. This robust power FET excels in switching applications, delivering reliable performance with an impressive 800V breakdown voltage and built-in diode for added convenience. Ideal for demanding industrial environments, it ensures superior thermal management and longevity, empowering your designs with unmatched quality and exceptional value. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides good mechanical strength and thermal stability, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance characteristics and lower on-resistance compared to P-channel devices, making them more efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier implementation in circuits requiring flyback protection, enhancing overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast response times and efficiency in power management.

Minimum DS Breakdown Voltage: 800 V

A high breakdown voltage makes this transistor suitable for high-voltage applications, providing a reliable choice for demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier handling and placement in PCBs, enhancing manufacturability.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical connections and better heat dissipation, making them ideal for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control over the FET's characteristics, which improves efficiency in power applications.

Maximum Pulsed Drain Current (IDM): 35 A

This high pulsed current capability allows the transistor to handle surges effectively, making it robust for transient loads.

Avalanche Energy Rating (EAS): 800 mJ

A high avalanche energy rating indicates robustness against high-energy pulses, enhancing reliability in rugged applications.

Maximum Drain Current (Abs) (ID): 8.2 A

This maximum drain current rating indicates the transistor can handle substantial loads, making it suitable for various applications.

No. of Terminals: 3

Having three terminals simplifies circuit design, allowing for compact implementations.

Maximum Power Dissipation (Abs): 180 W

A high power dissipation rating means the FET can handle significant energy without overheating, making it suitable for demanding power applications.

Package Style (Meter): FLANGE MOUNT

Flange mounting provides additional mechanical stability and better thermal contact with heat sinks, promoting effective heat management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high-speed operations and lower power consumption, making this FET efficient for various electronic applications.

Maximum Operating Temperature: 150 °C

A high operating temperature range assures reliable performance in tough thermal environments, enhancing overall product lifespan.

Transistor Element Material: SILICON

Silicon as a semiconductor material offers good performance, durability, and availability, making it the standard for many FETs.

Terminal Finish: MATTE TIN

Matte tin finish helps to ensure good solderability and corrosion resistance, promoting long-lasting connections.

Maximum Drain Current (ID): 8.2 A

This repeated maximum drain current rating confirms the FET's capability to handle decent continuous loads.

Maximum Drain-Source On Resistance: 1.2 ohm

The low on-resistance minimizes power losses during operation, increasing overall efficiency in circuitry.

Terminal Position: SINGLE

A single terminal position simplifies PCB layout and assembly, aiding in design efficiency.

Technical Specifications

Power Field Effect Transistors (FET) STW8N80 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

800 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

8.2 A

Maximum Drain Current (ID):

8.2 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

35 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW8N80 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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