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STW80NF12

STMicroelectronics

STW80NF12 by STMicroelectronics

STW80NF12 from STMicroelectronics is a powerful N-channel FET ideal for switching applications. It features a max drain current of 80 A, a breakdown voltage of 120 V, and operates at up to 175 °C. Its compact design ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,156 parts In-Stock

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4,156

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Anansix

USA . 539 parts In-Stock

1+ parts

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539

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Digiode

USA . 452 parts In-Stock

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452

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 370 parts In-Stock

1+ parts

$1.648

100+ parts

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1k+ parts

$1.483

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370

$1.648

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$1.483

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MKK Technologies

India . 1,887 parts In-Stock

1+ parts

$3.098

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1,887

$3.098

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DigiPath Technology Company

USA . 1,887 parts In-Stock

1+ parts

$3.098

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1,887

$3.098

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Corphita

USA . 4,231 parts In-Stock

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4,231

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 1,956 parts In-Stock

1+ parts

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$1.970

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1,956

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$1.970

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Overview

Unlock unparalleled performance with the STW80NF12 from STMicroelectronics! This top-tier N-channel Power FET delivers exceptional efficiency and reliability, making it ideal for demanding switching applications. Renowned for quality and innovation, STMicroelectronics ensures this transistor excels in power management and energy conversion, providing customers with robust solutions that enhance operational efficiency and longevity. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body provides durability and resistance to environmental factors, making this FET suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and better performance in switching applications, making this product a great choice for various circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode enhances circuit protection and simplifies design by integrating multiple functions into a single component.

Transistor Application: SWITCHING

Optimized for switching applications, this FET ensures fast and efficient operation, ideal for power management systems.

Minimum DS Breakdown Voltage: 120 V

A high breakdown voltage ensures reliability and safety in high-voltage applications, making it suitable for demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient space utilization on PCBs, facilitating easier integration into various designs.

Terminal Form: THROUGH-HOLE

Through-hole design provides robust mechanical stability and ease of soldering, ideal for maintaining reliable connections.

Operating Mode: ENHANCEMENT MODE

This mode allows for improved control and efficiency in switching operations, enhancing overall performance.

Maximum Pulsed Drain Current (IDM): 320 A

With a high pulsed current rating, this FET can handle demanding transient loads, making it suitable for high-current applications.

Avalanche Energy Rating (EAS): 700 mJ

A high avalanche energy rating provides additional protection against voltage spikes, enhancing reliability and longevity in circuits.

Maximum Drain Current (Abs) (ID): 80 A

This high maximum current rating enables the FET to efficiently handle significant loads without overheating.

No. of Terminals: 3

The three-terminal configuration simplifies circuit design while offering necessary functionalities for effective communication.

Maximum Power Dissipation (Abs): 300 W

High power dissipation capability ensures that the FET can manage large amounts of energy without failure, suitable for high-performance applications.

Package Style (Meter): IN-LINE

The in-line package style promotes space-saving designs and provides ease of assembly in various electronic projects.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for fast switching speeds and lower power consumption, making this FET energy efficient.

Maximum Operating Temperature: 175 °C

A high operating temperature rating ensures reliability in extreme environments, suitable for industrial and automotive applications.

Transistor Element Material: SILICON

Silicon is a reliable and widely used material in FET technology, providing good performance and longevity in devices.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and corrosion resistance, ensuring long-term reliability in various applications.

Maximum Drain Current (ID): 80 A

This specification indicates good current handling capability, necessary for applications that require high load management.

Maximum Drain-Source On Resistance: 0.018 ohm

A low on-resistance value ensures minimal power loss during operation, enhancing efficiency in electronic circuits.

Terminal Position: SINGLE

Having a single terminal position allows for simpler mounting and integration in electronic designs.

Case Connection: DRAIN

The drain connection configuration facilitates efficient power distribution and management, suitable for high-performance circuits.

Technical Specifications

Power Field Effect Transistors (FET) STW80NF12 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

700 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

120 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.018 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW80NF12 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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