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STW80NF55-08

STMicroelectronics

STW80NF55-08 by STMicroelectronics

STW80NF55-08 from STMicroelectronics is an N-channel FET ideal for switching applications, featuring a max drain current of 80 A and a breakdown voltage of 55 V. It operates in enhancement mode with low on-resistance of just 0.008 Ω. This robust transistor supports high power dissipation up to 300 W, making it suitable for demanding electronic circuits.

Median Price

$2.690

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 27 parts In-Stock

1+ parts

$2.690

100+ parts

$2.020

1k+ parts

$1.750

10k+ parts

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27

$2.690

$2.020

$1.750

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Vyrian

USA . 8,342 parts In-Stock

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Anansix

USA . 2,782 parts In-Stock

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2,782

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Digiode

USA . 1,975 parts In-Stock

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1,975

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LittleDiode

UK . 1 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1 parts In-Stock

1+ parts

$1.753

100+ parts

-

1k+ parts

$1.577

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1

$1.753

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$1.577

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MKK Technologies

India . 235 parts In-Stock

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$3.296

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235

$3.296

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DigiPath Technology Company

USA . 235 parts In-Stock

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$3.296

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235

$3.296

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AZTECH Wire

Italy . 919 parts In-Stock

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$20.630

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919

$20.630

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Component Stockers USA

USA . 309 parts In-Stock

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$99.990

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309

$99.990

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Alle Elektronik GmbH

Germany . 4,480 parts In-Stock

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4,480

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Corphita

USA . 3,844 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 120 parts In-Stock

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$2.096

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120

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$2.096

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Overview

Unlock the potential of your projects with the STW80NF55-08 from STMicroelectronics, a trusted leader in power solutions. This powerful N-channel FET ensures reliable switching performance for demanding applications, delivering exceptional efficiency and thermal management. Engineered for durability, it excels in high-current environments, making it perfect for automotive, industrial, and consumer electronics. Elevate your designs with quality you can depend on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher efficiency and lower on-resistance, making them ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides inherent protection against negative voltage spikes, enhancing reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid on-off operations efficiently.

Minimum DS Breakdown Voltage: 55 V

A minimum breakdown voltage of 55 V allows for use in high-voltage applications, increasing design flexibility.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient, allowing for compact thermal management in circuit designs.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides reliable structural integrity in assemblies, making it easy to solder and mount.

Operating Mode: ENHANCEMENT MODE

Enhancement mode ensures that the transistor remains off until a positive voltage is applied, leading to lower quiescent power consumption.

Maximum Pulsed Drain Current (IDM): 320 A

With a pulsed drain current rating of 320 A, this FET can handle heavy load demands, ideal for high-power applications.

Avalanche Energy Rating (EAS): 1000 mJ

A high avalanche energy rating means robust handling of transient voltage conditions, enhancing device reliability.

Maximum Drain Current (Abs) (ID): 80 A

The ability to handle a maximum drain current of 80 A allows for high-performance in demanding applications.

No. of Terminals: 3

A 3-terminal configuration simplifies circuit design while ensuring ample functionality for effective performance.

Maximum Power Dissipation (Abs): 300 W

A high power dissipation capability of 300 W allows for efficient operation in high-power systems without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style enables easy integration into cooling systems and improves thermal management in applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables faster switching speeds and lower power losses, ideal for modern electronic applications.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature ensures reliability in demanding environments, making it suitable for industrial use.

Transistor Element Material: SILICON

Silicon is a well-established material in semiconductor technology, offering excellent performance and stability.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides excellent solderability and corrosion resistance, ensuring long-term reliability in connections.

Maximum Drain Current (ID): 80 A

This specification repeats the ability to handle a maximum drain current of 80 A, reinforcing its robustness and applicability.

Maximum Drain-Source On Resistance: 0.008 ohm

A low on-resistance of 0.008 ohm results in minimal power loss during operation, enhancing overall efficiency.

Terminal Position: SINGLE

Single terminal positioning simplifies layout and design, facilitating easier integration into electronic systems.

Case Connection: DRAIN

Direct drain connection allows for efficient power management in circuit designs, enhancing overall performance.

Technical Specifications

Power Field Effect Transistors (FET) STW80NF55-08 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1000 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW80NF55-08 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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