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STW80NE06-10

STMicroelectronics

STW80NE06-10 by STMicroelectronics

STW80NE06-10 by STMicroelectronics is a N-channel Power FET with 60V DS breakdown voltage, 320A IDM, and 0.01 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a plastic/epoxy package. Operating in enhancement mode, it has an EAS of 350mJ and can handle up to 180W power dissipation.

Median Price

$2.780

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Sense

UK . 9 parts In-Stock

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$2.780

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9

$2.780

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ComSIT Distribution GmbH

Germany . 14,760 parts In-Stock

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14,760

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Vyrian

USA . 4,059 parts In-Stock

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4,059

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Digiode

USA . 2,403 parts In-Stock

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2,403

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Anansix

USA . 2,078 parts In-Stock

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2,078

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Component Electronics Inc.

Canada . 5 parts In-Stock

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LittleDiode

UK . 4 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,140 parts In-Stock

1+ parts

$0.854

100+ parts

-

1k+ parts

$0.768

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2,140

$0.854

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$0.768

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Component Stockers USA

USA . 3,642 parts In-Stock

1+ parts

$0.960

100+ parts

$0.910

1k+ parts

$0.890

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3,642

$0.960

$0.910

$0.890

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MKK Technologies

India . 1,593 parts In-Stock

1+ parts

$1.605

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1,593

$1.605

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DigiPath Technology Company

USA . 1,593 parts In-Stock

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$1.605

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1,593

$1.605

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AZTECH Wire

Italy . 56 parts In-Stock

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$10.600

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56

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A-Z Elektronik GmbH

Germany . 5,219 parts In-Stock

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5,219

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Alle Elektronik GmbH

Germany . 4,561 parts In-Stock

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Corphita

USA . 3,655 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Perfect Parts

USA . 1,643 parts In-Stock

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1,643

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Parana Technologies

USA . 1,056 parts In-Stock

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$1.021

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1,056

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$1.021

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Overview

Unleash the power of innovation with the STW80NE06-10 from STMicroelectronics, a leading manufacturer in the field of Power Field Effect Transistors (FET). This N-CHANNEL transistor offers superior performance in switching applications with its single configuration and built-in diode. With a maximum drain current of 80A and an impressive power dissipation rating of 180W, this transistor is designed to deliver reliable and efficient operation. Whether you're building high-performance electronics or industrial machinery, the STW80NE06-10 provides the quality, value, and reliability you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

This material is lightweight yet durable, making the product easy to handle and ensuring longevity.

Polarity or Channel Type N-CHANNEL

N-channel FETs typically have lower on-resistance and higher conductivity compared to P-channel FETs, making them efficient for various applications.

Minimum DS Breakdown Voltage 60 V

With a high breakdown voltage, this FET can withstand higher voltages without breakdown, making it suitable for robust applications.

Transistor Application SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and efficient performance.

Maximum Pulsed Drain Current (IDM) 320 A

The high pulsed drain current rating allows the FET to handle high current pulses without damage, making it suitable for heavy-duty applications.

Avalanche Energy Rating (EAS) 350 mJ

The high avalanche energy rating indicates that the FET can withstand sudden energy spikes, adding to its reliability in various operating conditions.

Maximum Power Dissipation (Abs) 180 W

With a high power dissipation rating, this FET can handle significant power without overheating, ensuring stable performance.

Field Effect Transistor Technology METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, making this FET suitable for demanding electronic applications.

Maximum Operating Temperature 175 °C

The high operating temperature rating allows the FET to function effectively in various temperature conditions, enhancing its versatility.

Maximum Drain-Source On Resistance 0.01 ohm

The low on-resistance of this FET results in minimal power loss and improved efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) STW80NE06-10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

350 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW80NE06-10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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