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STW8NB100

STMicroelectronics

STW8NB100 by STMicroelectronics

STW8NB100 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 1000V breakdown voltage, 29.2A max pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

$6.920

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 12 parts In-Stock

1+ parts

$6.920

100+ parts

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12

$6.920

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DF Sales Co.

USA . 12 parts In-Stock

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$6.920

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12

$6.920

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Vyrian

USA . 5,027 parts In-Stock

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5,027

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Digiode

USA . 3,491 parts In-Stock

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3,491

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Anansix

USA . 1,124 parts In-Stock

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1,124

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ComSIT Distribution GmbH

Germany . 160 parts In-Stock

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160

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Fibra_Brandt Electronic GMBH

Germany . 30 parts In-Stock

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30

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Connector Distribution Corp

USA . 30 parts In-Stock

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30

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Right Parts Inc.

USA . 30 parts In-Stock

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30

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Inventory MP

USA . 14 parts In-Stock

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Bristol Electronics

USA . 14 parts In-Stock

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14

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,365 parts In-Stock

1+ parts

$0.441

100+ parts

-

1k+ parts

$0.397

10k+ parts

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1,365

$0.441

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$0.397

-

MKK Technologies

India . 2,373 parts In-Stock

1+ parts

$0.829

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2,373

$0.829

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DigiPath Technology Company

USA . 2,373 parts In-Stock

1+ parts

$0.829

100+ parts

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2,373

$0.829

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AZTECH Wire

Italy . 904 parts In-Stock

1+ parts

$9.790

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904

$9.790

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A-Z Elektronik GmbH

Germany . 7,358 parts In-Stock

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7,358

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Alle Elektronik GmbH

Germany . 4,309 parts In-Stock

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4,309

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Corphita

USA . 3,230 parts In-Stock

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3,230

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Parana Technologies

USA . 1,026 parts In-Stock

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$0.527

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1,026

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$0.527

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Perfect Parts

USA . 87 parts In-Stock

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87

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Cyclops Electronics Ltd (Excess)

UK . 39 parts In-Stock

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39

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Overview

Unlock unparalleled efficiency and reliability with the STW8NB100 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel Power FET is expertly designed for high-performance switching applications, offering exceptional 1000V breakdown voltage and robust current handling capabilities. With its durable plastic/epoxy construction and built-in diode, it ensures optimal performance in demanding environments. Elevate your projects with the unmatched quality and expertise that STMicroelectronics delivers!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resilience against environmental factors, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration allows for better efficiency and faster switching speeds, making it ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by eliminating the need for external diodes, thus saving space and reducing component count.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for efficiency, reliability, and performance in various electronic circuits.

Minimum DS Breakdown Voltage: 1000 V

A high breakdown voltage enhances protection against voltage spikes, ensuring the device operates reliably in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient layout in PCB design, optimizing space and simplifying integration into devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical support and better thermal performance, making it suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows the FET to operate efficiently at low gate voltages, improving overall circuit performance and reducing power consumption.

Maximum Pulsed Drain Current (IDM): 29.2 A

High pulsed drain current capability permits brief overloading, making this FET versatile for dynamic applications in power electronics.

Avalanche Energy Rating (EAS): 700 mJ

A high avalanche energy rating ensures the transistor can withstand high-energy transients, increasing reliability in harsh operating environments.

Maximum Drain Current (Abs) (ID): 8 A

The ability to handle up to 8 A continuously enables this FET to be used in a variety of medium power applications.

No. of Terminals: 3

Three terminals make this device easy to use in simple circuit designs while ensuring proper connectivity in a variety of configurations.

Maximum Power Dissipation (Abs): 190 W

High power dissipation capability allows this FET to manage significant power loads without overheating, ensuring reliable operation.

Package Style (Meter): FLANGE MOUNT

Flange mount style enhances thermal dissipation and provides enhanced mechanical stability, making it suitable for high-power setups.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high input impedance and fast switching speeds, making this FET suitable for modern electronic circuits.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature rating allows the FET to function reliably in demanding environments, enhancing its range of applications.

Transistor Element Material: SILICON

Silicon as the element material provides excellent electrical properties and robustness, ensuring reliable performance in a wide range of applications.

Terminal Finish: MATTE TIN

Matte tin finish ensures good solderability and prevents oxidation, enhancing long-term reliability of connections.

Maximum Drain Current (ID): 7.3 A

With a continuous drain current of up to 7.3 A, this FET is perfect for applications requiring moderate power handling while ensuring efficiency.

Maximum Drain-Source On Resistance: 1.45 ohm

Low on-resistance minimizes power losses during operation, improving efficiencies in power conversion applications.

Terminal Position: SINGLE

A single terminal position simplifies integration into circuits, allowing for easy implementation without complex routing.

Technical Specifications

Power Field Effect Transistors (FET) STW8NB100 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

700 mJ

Minimum DS Breakdown Voltage:

1000 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

7.3 A

Maximum Drain-Source On Resistance:

1.45 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

29.2 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW8NB100 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-573-7496, 5961015737496

NIIN

015737496

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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