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STR710FR0H1TR

STMicroelectronics

STR710FR0H1TR by STMicroelectronics

STR710FR0H1TR microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max voltage of 3.6V, and supports up to 48 I/O lines. Ideal for commercial applications, it offers ADC and PWM channels for versatile control. Its compact design ensures efficient integration in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,982 parts In-Stock

1+ parts

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4,982

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Anansix

USA . 2,795 parts In-Stock

1+ parts

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2,795

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Vyrian

USA . 280 parts In-Stock

1+ parts

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280

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,963 parts In-Stock

1+ parts

$50.870

100+ parts

-

1k+ parts

$45.783

10k+ parts

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1,963

$50.870

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$45.783

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MKK Technologies

India . 2,103 parts In-Stock

1+ parts

$95.657

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2,103

$95.657

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DigiPath Technology Company

USA . 2,103 parts In-Stock

1+ parts

$95.657

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2,103

$95.657

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Corphita

USA . 3,738 parts In-Stock

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3,738

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Parana Technologies

USA . 1,317 parts In-Stock

1+ parts

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100+ parts

$60.822

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1,317

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$60.822

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Overview

Unlock unparalleled performance with the STR710FR0H1TR microcontroller from STMicroelectronics, a leader in innovative technology. This robust 32-bit solution is designed for seamless integration into various applications, from industrial automation to smart consumer devices. With its low power consumption and high efficiency, it ensures reliability and longevity, empowering your projects to thrive while reducing costs. Elevate your designs with STMicroelectronics' commitment to quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body ensures durability and reliability, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy integration into compact designs, saving space on PCBs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V allows for compatibility with various low-power applications.

Package Shape: SQUARE

The square shape of the package helps in efficient space utilization on the PCB.

Bit Size: 32

A 32-bit architecture enables high performance and the ability to handle complex operations efficiently.

No. of Terminals: 64

With 64 terminals, this microcontroller offers extensive connectivity options for peripherals and I/O operations.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style aids in high-density applications without compromising performance.

Minimum Supply Voltage: 3 V

The ability to operate at a minimum supply voltage of 3 V enhances usability in low-power circuits.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C allows for deployment in moderately harsh environments.

Minimum Operating Temperature: 0 °C

The ability to function from 0 °C ensures performance in a variety of ambient conditions.

ADC Channels: YES

Inclusion of ADC channels allows for digital conversion of analog signals, making it versatile for sensor applications.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient thermal management and reduces potential signal interference.

Maximum Seated Height: 1.7 mm

A low maximum seated height helps in minimizing the overall form factor of the application.

Width: 8 mm

The compact width allows for use in space-constrained designs, providing flexibility in layout.

Maximum Clock Frequency: 16.5 MHz

A clock frequency of 16.5 MHz ensures good performance for most embedded applications.

Length: 8 mm

The length of 8 mm contributes to a compact product design, ideal for modern electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grading indicates suitability for general environments, enhancing reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a RISC architecture enhances processing efficiency and performance for specific tasks.

Technology: CMOS

CMOS technology provides low power consumption, making this microcontroller elegant for battery-operated devices.

Terminal Form: BALL

Ball terminal form encourages better soldering quality and connection reliability.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is standard for many modern electronic devices, promoting widespread compatibility.

PWM Channels: YES

Having PWM channels allows for precise control of motors and other devices, enhancing application functionality.

ROM Programmability: FLASH

Flash programmability enables easier updates and the ability to rewrite memory, promoting flexibility in applications.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch accommodates finer PCB designs, suitable for compact assemblies.

Speed: 66 rpm

With a speed of 66 rpm, this microcontroller can handle moderate processing requirements effectively.

No. of I/O Lines: 48

Having 48 I/O lines provides ample interfaces for sensors, actuators, and other peripherals, bolstering application versatility.

Technical Specifications

Microcontrollers STR710FR0H1TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

8 mm

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

66 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Peripheral IC Type:

Trade Compliance

STR710FR0H1TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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