Loading...

STR710FR1H6TR

STMicroelectronics

STR710FR1H6TR by STMicroelectronics

STR710FR1H6TR by STMicroelectronics is a 32-bit RISC microcontroller designed for industrial applications, operating b/w -40 °C and 85°C. It features a max supply voltage of 3.6V, 64 terminals, and supports ADC/PWM channels. Ideal for low-profile designs with a clock speed of 16.5 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,797 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,797

-

-

-

-

Anansix

USA . 1,362 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,362

-

-

-

-

Vyrian

USA . 309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

309

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,065 parts In-Stock

1+ parts

$67.202

100+ parts

-

1k+ parts

$60.482

10k+ parts

-

2,065

$67.202

-

$60.482

-

MKK Technologies

India . 164 parts In-Stock

1+ parts

$126.370

100+ parts

-

1k+ parts

-

10k+ parts

-

164

$126.370

-

-

-

DigiPath Technology Company

USA . 164 parts In-Stock

1+ parts

$126.370

100+ parts

-

1k+ parts

-

10k+ parts

-

164

$126.370

-

-

-

Corphita

USA . 4,178 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,178

-

-

-

-

Parana Technologies

USA . 1,409 parts In-Stock

1+ parts

-

100+ parts

$80.351

1k+ parts

-

10k+ parts

-

1,409

-

$80.351

-

-

Overview

Unlock your project’s potential with the STR710FR1H6TR microcontroller from STMicroelectronics. Renowned for its quality and reliability, this versatile 32-bit solution excels in demanding applications, from industrial automation to consumer electronics. With robust performance in extreme conditions, it empowers developers to innovate effortlessly while ensuring energy efficiency. Experience seamless integration and superior functionality—elevate your designs with STR710FR1H6TR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures reliability and longevity in various operational environments.

Surface Mount: YES

Surface mount technology allows for a compact design, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The low max supply voltage enhances compatibility with a wide range of battery-powered devices.

Package Shape: SQUARE

A square package shape facilitates uniformity in PCB layout, simplifying assembly and design.

Bit Size: 32

A 32-bit architecture enables handling of complex computations and larger data sets efficiently.

No. of Terminals: 64

With 64 terminals, it provides ample I/O options to manage multiple peripherals and functionalities.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low profile design enhances thermal performance and fits neatly in compact applications.

Minimum Supply Voltage: 3 V

This flexibility in supply voltage allows for energy-efficient operation in low-power applications.

Maximum Operating Temperature: 85 °C

Withstanding high temperatures makes it suitable for industrial applications where environmental conditions can be harsh.

Minimum Operating Temperature: -40 °C

This capability ensures reliable operation in extreme cold environments, making it versatile for different locations.

ADC Channels: YES

Integration of ADC channels allows for direct analog signal processing, useful in sensor applications.

Terminal Position: BOTTOM

Bottom terminal positioning can enhance mounting stability and simplify the PCB design layout.

Maximum Seated Height: 1.7 mm

The low height allows for a sleeker design in final product assemblies while maintaining performance.

Width: 8 mm

Compact width supports space-efficient designs, critical for handheld or portable devices.

Maximum Clock Frequency: 16.5 MHz

This frequency provides adequate processing speed for most control tasks in embedded systems.

Length: 8 mm

The length complements the width to maintain a compact footprint, ideal for dense PCB layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in demanding applications and harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture contributes to higher performance and efficiency in executing instructions.

Technology: CMOS

CMOS technology offers lower power consumption, making it suitable for battery-operated devices.

Terminal Form: BALL

Ball terminals provide excellent solderability and mechanical strength, ensuring reliable connections.

Nominal Supply Voltage: 3.3 V

This standard supply voltage aligns with many digital systems, enhancing compatibility.

PWM Channels: YES

The presence of PWM channels allows for efficient control of motors and other actuators, ideal for various applications.

ROM Programmability: FLASH

FLASH programmability enables easy updates and reprogramming, which is essential for evolving project requirements.

Terminal Pitch: 0.8 mm

Small terminal pitch supports high-density designs, maximizing I/O capability on smaller boards.

Speed: 66 rpm

Adequate operation speed for many control tasks, offering versatility across multiple applications.

No. of I/O Lines: 48

Having 48 I/O lines provides significant interfacing possibilities for connecting various peripherals and performing complex functions.

Technical Specifications

Microcontrollers STR710FR1H6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

8 mm

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

66 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Peripheral IC Type:

Trade Compliance

STR710FR1H6TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19