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STR710FR1H6

STMicroelectronics

STR710FR1H6 by STMicroelectronics

STR710FR1H6 from STMicroelectronics is a 32-bit microcontroller designed for industrial applications, featuring a max supply voltage of 3.6V and operating temp range of -40 °C to 85°C. It supports ADC and PWM channels with 48 I/O lines. Its compact design ensures efficient performance in low-profile setups.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,781 parts In-Stock

1+ parts

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4,781

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Digiode

USA . 3,831 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,831

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Anansix

USA . 2,593 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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2,593

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 367 parts In-Stock

1+ parts

$29.586

100+ parts

-

1k+ parts

$26.628

10k+ parts

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367

$29.586

-

$26.628

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MKK Technologies

India . 1,409 parts In-Stock

1+ parts

$55.635

100+ parts

-

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10k+ parts

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1,409

$55.635

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DigiPath Technology Company

USA . 1,409 parts In-Stock

1+ parts

$55.635

100+ parts

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10k+ parts

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1,409

$55.635

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Corphita

USA . 2,007 parts In-Stock

1+ parts

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2,007

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Parana Technologies

USA . 845 parts In-Stock

1+ parts

-

100+ parts

$35.375

1k+ parts

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845

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$35.375

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Overview

Unlock innovation with the STR710FR1H6 microcontroller from STMicroelectronics—an industry leader in high-performance solutions. This versatile 32-bit powerhouse ensures robust reliability across a wide temperature range, making it perfect for industrial applications. With advanced features like multiple ADC and PWM channels, it enables seamless integration into your projects, enhancing efficiency and performance. Elevate your designs with ST's commitment to quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body provides excellent protection against environmental factors, ensuring a reliable performance in various conditions.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly, enabling the product to occupy less PCB space and be more suitable for modern designs.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V ensures compatibility with a variety of power supply systems, giving flexibility in design.

Package Shape: SQUARE

The square package shape promotes uniform thermal performance and simplifies PCB layout, facilitating better integration into designs.

Bit Size: 32

The 32-bit architecture offers greater processing power and efficiency, making it suitable for complex applications.

No. of Terminals: 64

With 64 terminals, this microcontroller provides a multitude of connectivity options, supporting versatile applications and interfacing capabilities.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low profile and fine pitch grid array design ensures optimal use of space and helps in achieving higher circuit density.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V allows it to function in low-power applications, therefore extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

This operating temperature range makes the microcontroller suitable for industrial applications where it may be exposed to higher temperatures.

Minimum Operating Temperature: -40 °C

The capability to operate at temperatures as low as -40 °C ensures it can function in extreme environments, broadening its application range.

ADC Channels: YES

The inclusion of ADC channels allows for the conversion of analog signals to digital, enabling the microcontroller to interface with a variety of sensors.

Terminal Position: BOTTOM

Bottom terminal positioning enhances thermal management and facilitates easier placement on PCBs during manufacturing.

Maximum Seated Height: 1.7 mm

The low seated height supports compact designs, making it easier to integrate into smaller devices without sacrificing performance.

Width: 8 mm

A width of 8 mm supports compact PCB design, optimizing space in modern electronic applications.

Maximum Clock Frequency: 16.5 MHz

A maximum clock frequency of 16.5 MHz provides adequate processing speed for many applications while still being power-efficient.

Length: 8 mm

The length of 8 mm further supports space-efficient design, making it ideal for compact electronic devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance in demanding applications and environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it benefits from simplified instruction sets which lead to increased performance and efficiency in processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal forms improve electrical connectivity and reduce the space required for mounting on PCBs, enhancing design flexibility.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V strikes an ideal balance between power efficiency and performance, suitable for many electronic applications.

PWM Channels: YES

The presence of PWM channels facilitates motor control and signal modulation, making the microcontroller suitable for various control applications.

ROM Programmability: FLASH

The use of FLASH memory allows for reprogramming and updating of firmware, providing flexibility and ease of use in development.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm supports high-density layouts, accommodating more connections in smaller areas for modern electronic designs.

Speed: 66 rpm

The operational speed of 66 rpm allows for efficient handling of tasks, suitable for time-sensitive applications.

No. of I/O Lines: 48

With 48 I/O lines, the microcontroller can interface with multiple peripherals, enhancing its versatility in application design.

Technical Specifications

Microcontrollers STR710FR1H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

8 mm

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

66 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Peripheral IC Type:

Trade Compliance

STR710FR1H6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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