Loading...

STR710FR1H3TR

STMicroelectronics

STR710FR1H3TR by STMicroelectronics

STR710FR1H3TR from STMicroelectronics is a 32-bit automotive microcontroller with a max supply voltage of 3.6V and operates b/w -40 °C to 125°C. It features 48 I/O lines, ADC, and PWM channels for versatile applications. Ideal for low-profile designs, it supports FLASH programmability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,905 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,905

-

-

-

-

Anansix

USA . 2,041 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,041

-

-

-

-

Vyrian

USA . 580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

580

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,172 parts In-Stock

1+ parts

$17.147

100+ parts

-

1k+ parts

$15.432

10k+ parts

-

1,172

$17.147

-

$15.432

-

MKK Technologies

India . 1,681 parts In-Stock

1+ parts

$32.244

100+ parts

-

1k+ parts

-

10k+ parts

-

1,681

$32.244

-

-

-

DigiPath Technology Company

USA . 1,681 parts In-Stock

1+ parts

$32.244

100+ parts

-

1k+ parts

-

10k+ parts

-

1,681

$32.244

-

-

-

Corphita

USA . 1,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,995

-

-

-

-

Parana Technologies

USA . 1,066 parts In-Stock

1+ parts

-

100+ parts

$20.502

1k+ parts

-

10k+ parts

-

1,066

-

$20.502

-

-

Overview

Unlock your project's potential with the STR710FR1H3TR microcontroller from STMicroelectronics. Renowned for innovation and reliability, STMicroelectronics delivers a high-quality solution that excels in automotive applications. With a robust design, this 32-bit powerhouse ensures optimal performance across diverse environments, enhancing efficiency and versatility. Experience seamless development, reduced time-to-market, and unparalleled support—empower your designs with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material ensures protection against environmental factors, making the microcontroller suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient manufacturing, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in powering the microcontroller within a safe voltage range, suitable for low-power applications.

Package Shape: SQUARE

Square form factor aids in uniform thermal dissipation and eases PCB layout design, enhancing overall reliability.

Bit Size: 32

32-bit architecture provides high processing power and efficiency, enabling complex computations and advanced functionalities.

No. of Terminals: 64

A higher number of terminals facilitates extensive connectivity options, allowing for more peripherals and I/O functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This style ensures efficient use of PCB space and supports high-density applications with finer pitch assembly.

Minimum Supply Voltage: 3 V

Lower supply voltage specification contributes to energy efficiency, extending battery life in portable devices.

Maximum Operating Temperature: 125 °C

High operating temperature range suitable for automotive and industrial applications, ensuring reliable performance under extreme conditions.

Minimum Operating Temperature: -40 °C

Operational capability in low temperatures increases versatility and adaptability to harsh environmental conditions.

ADC Channels: YES

Analog-to-digital conversion capability allows interfacing with sensors, making it suitable for applications requiring real-time data processing.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB assembly and routing, optimizing space and reducing manufacturing complexity.

Maximum Seated Height: 1.7 mm

Low profile design contributes to compactness in final product assembly, especially in space-constrained applications.

Width: 8 mm

Compact width helps in saving PCB space while still providing ample I/O options, ideal for miniaturized designs.

Maximum Clock Frequency: 16.5 MHz

Sufficient clock frequency for many applications, providing a balance between performance and power consumption.

Length: 8 mm

Short length is advantageous for dense electronic components layout, enhancing overall device performance and integration.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, ensuring reliability and performance in demanding automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient instruction execution, resulting in lower power consumption and higher performance.

Technology: CMOS

CMOS technology is known for low power consumption, making this microcontroller suitable for battery-operated devices.

Terminal Form: BALL

Ball terminal form aids in high-density packaging and allows for better thermal and electrical performance.

Nominal Supply Voltage: 3.3 V

A common nominal voltage that aligns with most digital circuits for easy integration and operation.

PWM Channels: YES

Pulse-width modulation capability enables effective control of motors and other peripherals, adding versatility to applications.

ROM Programmability: FLASH

Flash memory allows for reprogramming without losing application data, providing flexibility in software updates and modifications.

Terminal Pitch: 0.8 mm

Fine pitch allows for more terminals in a smaller area, optimizing PCB layout and accommodating complex designs.

Speed: 66 rpm

Sufficient speed capability for handling various tasks efficiently, making it versatile for diverse applications.

No. of I/O Lines: 48

A large number of I/O lines provides extensive interfacing options, suitable for connecting multiple peripherals and sensors.

Technical Specifications

Microcontrollers STR710FR1H3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

8 mm

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

66 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Peripheral IC Type:

Trade Compliance

STR710FR1H3TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19