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STR711FR2T6TR

STMicroelectronics

STR711FR2T6TR by STMicroelectronics

STR711FR2T6TR by STMicroelectronics is a 32-bit ARM7 microcontroller with a max clock frequency of 16.5 MHz. It has 64 terminals and offers connectivity options such as I2C, SPI, UART, and USB. This microcontroller is commonly used in industrial applications due to its temperature grade and low profile package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,595 parts In-Stock

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1,595

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Digiode

USA . 1,558 parts In-Stock

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1,558

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Anansix

USA . 424 parts In-Stock

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424

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 871 parts In-Stock

1+ parts

$9.257

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871

$9.257

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Ampacity Inc.

Singapore . 319 parts In-Stock

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$12.000

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319

$12.000

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Aztec Data Supply Inc.

USA . 4,964 parts In-Stock

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$28.693

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4,964

$28.693

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IDEA Electronic Components Group

UK . 1,415 parts In-Stock

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$38.869

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$34.982

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1,415

$38.869

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$34.982

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MKK Technologies

India . 506 parts In-Stock

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$73.091

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506

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DigiPath Technology Company

USA . 506 parts In-Stock

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$73.091

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506

$73.091

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Corohmni

South Africa . 892 parts In-Stock

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$73.950

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$73.950

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Argo Parts USA

USA . 5,277 parts In-Stock

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Corphita

USA . 2,139 parts In-Stock

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Continental Prestige Electronics

USA . 2,138 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Parana Technologies

USA . 146 parts In-Stock

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$46.474

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146

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$46.474

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Overview

Discover the STR711FR2T6TR microcontroller by STMicroelectronics, a high-quality product that combines advanced technology with reliability. With its 32-bit ARM7 CPU family, this microcontroller offers exceptional performance and versatility for a wide range of applications. Whether you need precise timing with its RTC and TIMER features, or seamless connectivity through I2C, SPI, UART, and USB, this microcontroller has got you covered. Its compact size, low power consumption, and industrial temperature grade make it perfect for embedded systems and IoT devices. Experience the value and benefits of the STR711FR2T6TR and unlock endless possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly of the microcontroller onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle higher voltages for increased performance and versatility in different applications.

Bit Size: 32

A 32-bit architecture offers enhanced processing power, allowing the microcontroller to handle complex tasks and calculations efficiently.

Power Supplies (V): 3.3

Operating at a nominal supply voltage of 3.3V, this microcontroller is energy-efficient and can be powered by commonly available power sources.

No. of Terminals: 64

The 64 terminals provide ample connectivity options for interfacing with external devices and peripherals, making the microcontroller versatile in different applications.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals into digital data, enabling precise measurements and sensor interfacing.

ROM Words: 32768

The large ROM size of 32768 words provides ample storage for program code and data, allowing for more complex and feature-rich applications to be implemented.

RAM Bytes: 65536

With a generous amount of RAM at 65536 bytes, the microcontroller can efficiently store and access data during operation, facilitating smooth and responsive performance.

Connectivity: I2C(2), SMARTCARD, SPI(2), UART(4), USB

Multiple connectivity options including I2C, SPI, UART, and USB enable easy communication with various devices and peripherals, enhancing the versatility and compatibility of the microcontroller.

Technical Specifications

Microcontrollers STR711FR2T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

30

No. of Terminals:

64

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

16K

Connectivity:

I2C(2), SMARTCARD, SPI(2), UART(4), USB

Peripherals:

RTC, TIMER(5)

Analog To Digital Convertors:

4-Ch 12-Bit

Trade Compliance

STR711FR2T6TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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