Loading...

STR710FR1T1TR

STMicroelectronics

STR710FR1T1TR by STMicroelectronics

STR710FR1T1TR microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max voltage of 3.6V, and supports up to 48 I/O lines. Its compact design is ideal for embedded applications requiring efficient processing. With a max clock frequency of 16.5 MHz, it excels in various commercial uses.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,665 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,665

-

-

-

-

Vyrian

USA . 2,395 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,395

-

-

-

-

Anansix

USA . 1,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 793 parts In-Stock

1+ parts

$67.358

100+ parts

-

1k+ parts

$60.622

10k+ parts

-

793

$67.358

-

$60.622

-

MKK Technologies

India . 1,079 parts In-Stock

1+ parts

$126.662

100+ parts

-

1k+ parts

-

10k+ parts

-

1,079

$126.662

-

-

-

DigiPath Technology Company

USA . 1,079 parts In-Stock

1+ parts

$126.662

100+ parts

-

1k+ parts

-

10k+ parts

-

1,079

$126.662

-

-

-

Corphita

USA . 3,896 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,896

-

-

-

-

Parana Technologies

USA . 1,643 parts In-Stock

1+ parts

-

100+ parts

$80.536

1k+ parts

-

10k+ parts

-

1,643

-

$80.536

-

-

Overview

Elevate your projects with the STR710FR1T1TR microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for versatility, this 32-bit powerhouse excels in a range of applications, from industrial automation to consumer electronics. With its compact size and low power consumption, it ensures efficiency without compromising on performance. Experience unparalleled reliability and support, making it the smart choice for developers seeking to enhance their designs swiftly and effectively.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures reliability and protects the microcontroller from environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient assembly, making it ideal for modern electronic devices.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V is suitable for low-power applications, ensuring less energy consumption.

Package Shape: SQUARE

The square shape optimizes space and helps in efficient layout on printed circuit boards.

Bit Size: 32

With a 32-bit architecture, it offers higher performance and the ability to process larger amounts of data efficiently.

No. of Terminals: 64

The 64 terminals provide extensive connectivity options, enabling greater interfacing with various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This packaging style facilitates a lower profile footprint, which is advantageous for space-constrained applications.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V allows for compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

The ability to operate at temperatures up to 70 °C ensures reliability in various environments and applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, the microcontroller can function in standard environmental conditions.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to interface with analog sensors, enhancing its versatility.

Terminal Position: QUAD

Quad terminal positioning provides easy access for connections, facilitating flexible circuit designs.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm contributes to a slim profile, allowing it to fit in compact designs.

Width: 10 mm

A width of 10 mm enables efficient use of board space while maintaining robust performance.

Maximum Clock Frequency: 16.5 MHz

A maximum clock frequency of 16.5 MHz supports fast processing speeds, suitable for demanding applications.

Length: 10 mm

The 10 mm length helps in maintaining a uniform package size, simplifying design considerations.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates the microcontroller is designed for use in general-purpose applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers efficient instruction processing, leading to higher performance in computation.

Technology: CMOS

The CMOS technology maximizes power efficiency and minimizes heat generation, prolonging the lifespan of the device.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder connections and ease of mounting during manufacturing.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is commonly used in digital circuits, enhancing compatibility with other devices.

PWM Channels: YES

The presence of PWM channels allows for precise control in various applications, such as motor control or signal modulation.

ROM Programmability: FLASH

Flash programmability offers flexibility for software updates and modifications without needing physical changes to the hardware.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm is suited for high-density designs, maximizing the number of pins on a smaller area.

Speed: 66 rpm

The specified speed makes it suitable for real-time applications where response time is crucial.

No. of I/O Lines: 48

With 48 I/O lines available, it provides extensive options for interfacing with various external components.

Technical Specifications

Microcontrollers STR710FR1T1TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STR710FR1T1TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19