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STR710FR0H3TR

STMicroelectronics

STR710FR0H3TR by STMicroelectronics

STR710FR0H3TR from STMicroelectronics is a 32-bit automotive microcontroller with a max supply voltage of 3.6V and operates b/w -40 °C to 125°C. It features 48 I/O lines, ADC, and PWM channels for versatile applications in automotive systems. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,815 parts In-Stock

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1,815

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Digiode

USA . 1,223 parts In-Stock

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1,223

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Vyrian

USA . 737 parts In-Stock

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737

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,003 parts In-Stock

1+ parts

$66.326

100+ parts

-

1k+ parts

$59.694

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2,003

$66.326

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$59.694

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MKK Technologies

India . 182 parts In-Stock

1+ parts

$124.723

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182

$124.723

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DigiPath Technology Company

USA . 182 parts In-Stock

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$124.723

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182

$124.723

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Corphita

USA . 1,733 parts In-Stock

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1,733

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Parana Technologies

USA . 148 parts In-Stock

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$79.303

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148

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Overview

Unlock the power of innovation with the STR710FR0H3TR from STMicroelectronics—a leading name in microcontroller excellence. Engineered for reliability and performance, this 32-bit marvel is perfect for automotive applications, offering robust temperature resilience and energy efficiency. With its compact design and advanced features like ADC and PWM capabilities, it ensures seamless integration into your projects, driving value while enhancing functionality. Elevate your designs with a trusted partner in technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability, making the microcontroller suitable for various applications, especially in automotive environments.

Surface Mount: YES

Surface mount technology allows for compact designs and enables easier integration into smaller circuits.

Maximum Supply Voltage: 3.6 V

This maximum supply voltage ensures compatibility with a variety of low-voltage systems, expanding its application range.

Package Shape: SQUARE

The square shape aids in uniform heat distribution and efficient use of PCB space.

Bit Size: 32

A 32-bit architecture allows for efficient processing and complex computations, making it suitable for advanced applications.

No. of Terminals: 64

With 64 terminals, this microcontroller can connect to a large number of peripherals and inputs, enhancing functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This style enables a compact footprint on the PCB, facilitating space-saving designs for applications with size constraints.

Minimum Supply Voltage: 3 V

This low minimum supply voltage increases flexibility for different power supply designs, catering to varying system requirements.

Maximum Operating Temperature: 125 °C

A high operating temperature rating allows this microcontroller to function reliably in demanding environments.

Minimum Operating Temperature: -40 °C

This low temperature rating makes it suitable for operation in harsh climates, ideal for automotive and industrial applications.

ADC Channels: YES

Inclusion of ADC channels facilitates accurate analog-to-digital conversion, crucial for sensor interfacing.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient use of PCB space and simplifies soldering.

Maximum Seated Height: 1.7 mm

A low seated height minimizes the overall profile of the device, contributing to compact designs.

Width: 8 mm

This width ensures a balance between performance and compactness, fitting into space-constrained applications.

Maximum Clock Frequency: 16.5 MHz

A maximum clock frequency of 16.5 MHz enables efficient processing of tasks without excessive power consumption.

Length: 8 mm

This length complements the width effectively, maintaining a small overall footprint.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, ensuring reliability and safety in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high efficiency and performance per watt, making it suitable for battery-powered applications.

Technology: CMOS

CMOS technology ensures low power consumption, making this microcontroller energy-efficient.

Terminal Form: BALL

Ball terminal form improves the connection reliability and allows for easier heat dissipation.

Nominal Supply Voltage: 3.3 V

Optimized for a supply voltage of 3.3 V, enhancing compatibility with a wide range of modern electronic systems.

PWM Channels: YES

PWM channels enable efficient motor control and other timing applications, increasing the versatility of the microcontroller.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, beneficial for iterative development processes.

Terminal Pitch: 0.8 mm

A fine terminal pitch supports higher density designs, allowing for more functionality in compact spaces.

Speed: 66 rpm

The specified speed supports motion control applications, contributing to the versatility of the microcontroller in various environments.

No. of I/O Lines: 48

Having 48 I/O lines offers significant flexibility for interfacing with external devices, sensors, and other components.

Technical Specifications

Microcontrollers STR710FR0H3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

8 mm

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

66 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Peripheral IC Type:

Trade Compliance

STR710FR0H3TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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