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STR710FR0T3

STMicroelectronics

STR710FR0T3 by STMicroelectronics

STR710FR0T3 by STMicroelectronics is a 32-bit automotive microcontroller with a max supply voltage of 3.6V and operates b/w -40 °C to 125°C. It features 48 I/O lines, ADC, and PWM channels for versatile applications in automotive systems. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,050 parts In-Stock

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4,050

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Vyrian

USA . 2,540 parts In-Stock

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2,540

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Anansix

USA . 989 parts In-Stock

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989

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 68 parts In-Stock

1+ parts

$24.313

100+ parts

-

1k+ parts

$21.882

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68

$24.313

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$21.882

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MKK Technologies

India . 190 parts In-Stock

1+ parts

$45.719

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190

$45.719

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DigiPath Technology Company

USA . 190 parts In-Stock

1+ parts

$45.719

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190

$45.719

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Corphita

USA . 3,783 parts In-Stock

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3,783

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Parana Technologies

USA . 1,502 parts In-Stock

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$29.070

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1,502

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$29.070

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Overview

Elevate your projects with the STR710FR0T3 microcontroller from STMicroelectronics, a leader in innovative technology. Designed for automotive applications, this 32-bit powerhouse offers exceptional reliability and performance under extreme conditions. With its compact, low-profile design and advanced features like ADC and PWM channels, it simplifies complex tasks while ensuring energy efficiency. Trust STMicroelectronics to deliver quality that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling efficient use of PCB space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V indicates compatibility with a range of low-power battery-operated applications.

Package Shape: SQUARE

The square package shape helps in efficient space utilization and simplifies the PCB design process.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and multiple tasks simultaneously, enhancing performance.

No. of Terminals: 64

A higher number of terminals allows for increased connectivity options, enabling various peripheral interfaces and I/O operations.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack design allows for a slimmer profile, critical in space-constrained applications while maintaining fine pitch for dense layouts.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V is suitable for energy-efficient designs, enhancing battery life in portable devices.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability and functionality in demanding automotive and industrial environments.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures makes this microcontroller ideal for harsh environments and diverse applications.

ADC Channels: YES

Integrated ADC channels allow for direct sensor interfacing, making it suitable for applications requiring analog signal processing.

Terminal Position: QUAD

Quad terminal positioning aids in efficient space usage on PCBs while providing robust electrical connections.

Maximum Seated Height: 1.6 mm

A low seated height facilitates a compact design and is suitable for modern slim electronic devices.

Width: 10 mm

The compact width allows for easy integration into smaller devices, making it versatile for various applications.

Maximum Clock Frequency: 16.5 MHz

A maximum clock frequency of 16.5 MHz provides sufficient processing speed for real-time applications and control tasks.

Length: 10 mm

A compact length is essential for space-constrained applications, providing flexibility in design.

Temperature Grade: AUTOMOTIVE

Certified for automotive use, ensuring reliability and performance in demanding automotive environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture allows for faster execution of instructions, optimizing processing efficiency.

Technology: CMOS

CMOS technology ensures low power consumption, making it suitable for battery-powered and energy-efficient applications.

Terminal Form: GULL WING

Gull wing terminal form provides excellent soldering integrity and ease of assembly during manufacturing.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V allows compatibility with many modern electronic components and is ideal for efficient power usage.

PWM Channels: YES

PWM channels enable fine control over motors and lighting applications, expanding the versatility of the microcontroller.

ROM Programmability: FLASH

With FLASH programmability, firmware can be easily updated or modified, providing flexibility for development.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density PCB layouts, making it ideal for compact, modern electronic designs.

Speed: 66 rpm

The operational speed of 66 rpm is beneficial for applications requiring consistent and reliable rotational speed control.

No. of I/O Lines: 48

With 48 I/O lines, this microcontroller offers substantial interfacing capabilities, accommodating a wide range of sensors and actuators.

Technical Specifications

Microcontrollers STR710FR0T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STR710FR0T3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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