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STM708SM6E

STMicroelectronics

STM708SM6E by STMicroelectronics

STM708SM6E by STMicroelectronics is a versatile power management IC with a nominal voltage of 3.3V and operates in temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports supply voltages from 1.2V to 5.5V, ideal for industrial applications. Its compact design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Pegasus Components GmbH

Germany . 5,597 parts In-Stock

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5,597

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Vyrian

USA . 4,614 parts In-Stock

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4,614

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Digiode

USA . 3,599 parts In-Stock

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3,599

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ComSIT Distribution GmbH

Germany . 2,430 parts In-Stock

1+ parts

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2,430

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Anansix

USA . 853 parts In-Stock

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853

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PC Components Company LLC

USA . 15 parts In-Stock

1+ parts

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15

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Bristol Electronics

USA . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,146 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

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1,146

$3.500

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Microchip USA

USA . 411 parts In-Stock

1+ parts

$6.682

100+ parts

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411

$6.682

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IDEA Electronic Components Group

UK . 513 parts In-Stock

1+ parts

$7.345

100+ parts

-

1k+ parts

$6.611

10k+ parts

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513

$7.345

-

$6.611

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AZTECH Wire

Italy . 141 parts In-Stock

1+ parts

$10.600

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141

$10.600

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MKK Technologies

India . 151 parts In-Stock

1+ parts

$13.812

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151

$13.812

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DigiPath Technology Company

USA . 151 parts In-Stock

1+ parts

$13.812

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151

$13.812

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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A-Z Elektronik GmbH

Germany . 5,972 parts In-Stock

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5,972

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Corphita

USA . 2,869 parts In-Stock

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2,869

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Vigor

Singapore . 1,366 parts In-Stock

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1,366

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Parana Technologies

USA . 1,272 parts In-Stock

1+ parts

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$8.782

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1,272

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$8.782

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Overview

Unlock the potential of your designs with the STM708SM6E from STMicroelectronics—a trusted leader in power management solutions. This compact and robust IC enhances efficiency and reliability across applications like industrial automation, automotive systems, and consumer electronics. With a wide operating temperature range and superior thermal performance, you can count on its durability. Experience unmatched quality and elevate your projects with the innovation that STMicroelectronics delivers!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection from environmental factors, ensuring reliability in various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and simplifies assembly processes, making it suitable for compact devices.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier integration into design layouts and efficient thermal management.

Nominal Supply Voltage (Vsup): 3.3 V

With a nominal supply voltage of 3.3 V, this IC is ideal for low-power applications, enhancing energy efficiency.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages (3.3 and 5 V) makes this IC versatile for various electronic designs.

No. of Terminals: 8

An 8-terminal configuration allows for a balance between connectivity and compactness, suitable for many applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces the overall footprint of circuits, allowing for higher component density in designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is reliable for industrial environments, ensuring stable performance.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows the IC to function in extreme conditions, ensuring reliability in diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold terminal finish provides excellent corrosion resistance and solderability, enhancing the longevity of connections.

Terminal Position: DUAL

Dual terminal positioning enables efficient layout options and simplifies PCB design, making it easier for integration.

Maximum Seated Height: 1.75 mm

A low maximum seated height helps in maintaining a compact profile in system designs, allowing for space-saving solutions.

Width: 3.9 mm

With a width of 3.9 mm, this IC is suitable for space-constrained applications, providing design flexibility.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is essential for stabilizing voltage and reducing power supply noise in electronic systems.

Minimum Supply Voltage (Vsup): 1.2 V

The capability to operate at a minimum supply voltage of 1.2 V makes it suitable for low-voltage applications, enhancing design options.

Length: 4.9 mm

A length of 4.9 mm contributes to the compact size of this component, ideal for portable and space-constrained applications.

Nominal Threshold Voltage (V): +2.93V

With a nominal threshold voltage of +2.93 V, this IC operates efficiently within a range ideal for modern digital circuits.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures the IC performs reliably over a wide range of temperatures, suitable for demanding conditions.

Maximum Supply Current (Isup): 0.06 mA

A maximum supply current of only 0.06 mA highlights the IC's low power consumption, making it an efficient choice for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form allows for better mechanical bonding to the PCB, ensuring robust connections during use.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides a standardized spacing that enhances compatibility with various PCBs and simplifies assembly.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to handle a maximum supply voltage of 5.5 V increases the versatility of this IC in different power environments.

Technical Specifications

Power Management ICs STM708SM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.93V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Width (mm):

3.9 mm

Trade Compliance

STM708SM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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