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STM708SDS6F

STMicroelectronics

STM708SDS6F by STMicroelectronics

STM708SDS6F by STMicroelectronics is a compact power management IC with a nominal voltage of 3.3V and operates in extreme temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports voltages up to 5.5V. Ideal for industrial applications, it ensures reliable power supply support in space-constrained designs.

Median Price

$0.216

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4,000 parts In-Stock

1+ parts

-

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$0.217

4,000

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$0.217

Verical

USA . 4,000 parts In-Stock

1+ parts

-

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-

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$0.214

4,000

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$0.214

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 9,163 parts In-Stock

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9,163

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Vyrian

USA . 4,709 parts In-Stock

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4,709

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TME

Poland . 4,000 parts In-Stock

1+ parts

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$0.337

4,000

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-

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$0.337

Anansix

USA . 1,263 parts In-Stock

1+ parts

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1,263

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Digiode

USA . 81 parts In-Stock

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81

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,828 parts In-Stock

1+ parts

$0.181

100+ parts

-

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-

3,828

$0.181

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Vigor

Singapore . 2,025 parts In-Stock

1+ parts

$0.960

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2,025

$0.960

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Component Stockers USA

USA . 218 parts In-Stock

1+ parts

$2.730

100+ parts

$2.010

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218

$2.730

$2.010

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Microchip USA

USA . 5,567 parts In-Stock

1+ parts

$10.249

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5,567

$10.249

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AZTECH Wire

Italy . 52 parts In-Stock

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$12.630

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52

$12.630

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IDEA Electronic Components Group

UK . 2,088 parts In-Stock

1+ parts

$14.038

100+ parts

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$12.634

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2,088

$14.038

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$12.634

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MKK Technologies

India . 245 parts In-Stock

1+ parts

$26.398

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245

$26.398

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DigiPath Technology Company

USA . 245 parts In-Stock

1+ parts

$26.398

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245

$26.398

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Perfect Parts

USA . 20,097 parts In-Stock

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20,097

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Corphita

USA . 3,220 parts In-Stock

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3,220

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A-Z Elektronik GmbH

Germany . 2,300 parts In-Stock

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2,300

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Parana Technologies

USA . 615 parts In-Stock

1+ parts

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$16.785

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615

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$16.785

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Overview

Unlock the potential of your designs with the STM708SDS6F from STMicroelectronics, a leader in innovative power management solutions. This compact and reliable IC delivers exceptional performance across a wide temperature range, making it perfect for industrial applications. Experience superior efficiency and reliability that translates to enhanced product longevity and reduced energy costs. Elevate your projects with the trusted quality and cutting-edge technology only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material ensures the IC can withstand various environmental conditions while maintaining performance.

Surface Mount: YES

Surface mount technology allows for easy integration into automated assembly processes, reducing manufacturing time and costs.

Package Shape: SQUARE

The square shape provides efficient space usage on the PCB, allowing for compact designs and optimized layout.

Nominal Supply Voltage (Vsup): 3.3 V

A common voltage value that ensures compatibility with many modern digital circuits, making the IC versatile.

Power Supplies (V): 3.3/5

Supports multiple voltage levels, providing flexibility for a variety of applications and designs.

No. of Terminals: 8

With 8 terminals, this IC offers sufficient connectivity options while keeping pin complexity manageable.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch design allow for high-density PCB layouts, which is crucial for compact devices.

Maximum Operating Temperature: 85 °C

This temperature rating makes the IC suitable for a wide range of industrial applications, ensuring reliable performance under heat.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures increases the IC’s reliability in harsh environments, making it ideal for industrial applications.

Terminal Finish: MATTE TIN

The matte tin finish offers good solderability and oxidation resistance, enhancing durability and performance during assembly.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility on the PCB, facilitating easier routing and control.

Maximum Seated Height: 1.1 mm

This low profile allows for more compact device designs, benefiting applications where space is constrained.

Width: 3 mm

The compact width is ideal for densely populated PCBs, allowing for efficient use of board space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Tailored for power supply management, this IC is essential in ensuring stable voltage levels in various applications.

Minimum Supply Voltage (Vsup): 1.2 V

Supports a wide input voltage range, making it adaptable for different power supply scenarios.

Length: 3 mm

With a compact length, this IC fit well in space-limited applications, contributing to efficient design.

Nominal Threshold Voltage (V): +2.93V

The threshold voltage allows for effective switching, ensuring the IC performs reliably in operational environments.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC ensures superior performance and reliability across a range of environmental conditions.

Maximum Supply Current (Isup): 0.06 mA

Low supply current helps in minimizing power consumption, making the IC energy-efficient and suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide stable connections and ease of soldering, enhancing the reliability of the circuit.

Terminal Pitch: 0.65 mm

With a suitable pitch, this IC allows for compatibility with various PCB designs while ensuring good electrical performance.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage capability allows the IC to be versatile for different applications requiring higher voltage levels.

Technical Specifications

Power Management ICs STM708SDS6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.93V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Width (mm):

3 mm

Trade Compliance

STM708SDS6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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