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STM705M6E

STMicroelectronics

STM705M6E by STMicroelectronics

STM705M6E by STMicroelectronics is a compact power management IC designed for industrial applications. It operates within a supply voltage range of 1.2V to 5.5V, with a max current of 0.06mA and temp range from -40 °C to 85 °C. Its small outline package ensures efficient surface mounting in various devices.

Median Price

$0.928

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 34 parts In-Stock

1+ parts

$1.480

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-

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34

$1.480

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Arrow

USA . 34 parts In-Stock

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-

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$0.928

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34

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$0.928

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Verical

USA . 34 parts In-Stock

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-

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$0.928

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34

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$0.928

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 577 parts In-Stock

1+ parts

$1.406

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577

$1.406

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Vyrian

USA . 5,500 parts In-Stock

1+ parts

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5,500

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ComSIT Distribution GmbH

Germany . 898 parts In-Stock

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898

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Anansix

USA . 682 parts In-Stock

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682

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Distributors (Availability)

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Corphita

USA . 829 parts In-Stock

1+ parts

$1.332

100+ parts

-

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829

$1.332

-

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$3.358

100+ parts

$3.056

1k+ parts

$2.754

10k+ parts

-

2,500

$3.358

$3.056

$2.754

-

Microchip USA

USA . 160 parts In-Stock

1+ parts

$4.004

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160

$4.004

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AZTECH Wire

Italy . 598 parts In-Stock

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$9.720

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598

$9.720

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IDEA Electronic Components Group

UK . 499 parts In-Stock

1+ parts

$16.584

100+ parts

-

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$14.926

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499

$16.584

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$14.926

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MKK Technologies

India . 372 parts In-Stock

1+ parts

$31.185

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372

$31.185

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DigiPath Technology Company

USA . 372 parts In-Stock

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$31.185

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372

$31.185

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A-Z Elektronik GmbH

Germany . 5,084 parts In-Stock

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5,084

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Vigor

Singapore . 2,329 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,548 parts In-Stock

1+ parts

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$19.829

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1,548

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$19.829

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Kepictronics

USA . 280 parts In-Stock

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280

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Overview

Unlock unparalleled energy efficiency and reliability with the STM705M6E from STMicroelectronics! Designed for seamless power management, this compact IC thrives in diverse industrial applications, ensuring your devices operate flawlessly across varying temperatures. Trust in STMicroelectronics' legacy of excellence to deliver superior performance and durability, enhancing your products' value while reducing operational costs. Experience a new level of innovation today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and provides an effective barrier against environmental factors, making this IC reliable in various applications.

Surface Mount: YES

Surface mount technology allows for a simpler assembly process and a smaller footprint on the PCB, enabling more compact designs.

Package Shape: RECTANGULAR

Rectangular packages offer efficient space utilization on the PCB, which is ideal for modern design requirements.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard nominal supply voltage makes this IC compatible with a wide range of electronic applications.

Power Supplies: 1.5/5

Support for both 1.5V and 5V power supplies provides flexibility, allowing for use in various systems without requiring additional voltage regulation.

No. of Terminals: 8

The 8-terminal configuration is optimal for compact designs while still allowing for a range of input and output connections.

Package Style (Meter): SMALL OUTLINE

Small outline packages help in reducing the overall size of the circuits, catering to space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC is suitable for industrial environments, ensuring reliability under heat stress.

Minimum Operating Temperature: -40 °C

A wide operational temperature range allows this IC to function effectively in extreme conditions, thus enhancing versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish offers excellent corrosion resistance and improves solderability, promoting long-term reliability.

Terminal Position: DUAL

Dual terminal positioning provides flexible connectivity options, facilitating easier PCB design and layout.

Maximum Seated Height: 1.75 mm

A low seated height minimizes the overall profile of the component, which is crucial for slim device designs.

Width: 3.9 mm

Narrow width allows for compact layout designs on PCBs, enabling more efficient use of space.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management IC, it ensures efficient power distribution and management within circuits, which improves energy efficiency.

Minimum Supply Voltage (Vsup): 1.2 V

With a low minimum supply voltage requirement, this IC can be powered in low-voltage applications, broadening its use case.

Length: 4.9 mm

Short length contributes to a compact PCB design, allowing engineers to integrate multiple components with ease.

Nominal Threshold Voltage (V): +4.63V

The nominal threshold voltage is ideal for applications requiring stable power management at specific voltage levels.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature ratings ensure that the IC reliably operates in harsh conditions, making it suitable for industrial applications.

Maximum Supply Current (Isup): 0.06 mA

Low current consumption contributes to energy efficiency, making this IC suitable for battery-powered applications.

Terminal Form: GULL WING

Gull-wing leads facilitate easy soldering techniques during manufacturing, ensuring strong and reliable electrical connections.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is a standard size that helps minimize the risk of solder bridging, enhancing manufacturing yield.

Maximum Supply Voltage (Vsup): 5.5 V

With the capability to handle a maximum supply voltage of 5.5V, this IC is versatile for different power supply scenarios.

Technical Specifications

Power Management ICs STM705M6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.63V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.63V

Width (mm):

3.9 mm

Trade Compliance

STM705M6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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