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STGY80H65DFB

STMicroelectronics

STGY80H65DFB by STMicroelectronics

STMicroelectronics' STGY80H65DFB is an N-CHANNEL IGBT with 650V VCEsat, 120A IC, and 469W Pd. Ideal for POWER CONTROL applications due to its fast turn-off time of 358ns and high operating temperature range (-55 °C to 175°C).

Median Price

$11.690

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 362 parts In-Stock

1+ parts

$13.140

100+ parts

$8.113

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-

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362

$13.140

$8.113

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Future Electronics

Canada . 600 parts In-Stock

1+ parts

-

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$10.240

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$10.000

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600

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$10.240

$10.000

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Distributors (In-Stock)

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Digiode

USA . 3,038 parts In-Stock

1+ parts

$9.975

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3,038

$9.975

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IBS Electronics

USA . 600 parts In-Stock

1+ parts

$13.650

100+ parts

$13.208

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$13.000

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600

$13.650

$13.208

$13.000

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Vyrian

USA . 7,856 parts In-Stock

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7,856

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Anansix

USA . 1,808 parts In-Stock

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1,808

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 609 parts In-Stock

1+ parts

$1.301

100+ parts

-

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$1.171

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609

$1.301

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$1.171

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MKK Technologies

India . 1,998 parts In-Stock

1+ parts

$2.446

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$2.446

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DigiPath Technology Company

USA . 1,998 parts In-Stock

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$2.446

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1,998

$2.446

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Corphita

USA . 2,678 parts In-Stock

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$9.450

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2,678

$9.450

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Microchip USA

USA . 426 parts In-Stock

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$40.460

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426

$40.460

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Perfect Parts

USA . 596 parts In-Stock

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596

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Parana Technologies

USA . 19 parts In-Stock

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$1.555

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19

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$1.555

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Overview

Unlock the power of efficient and reliable power control with the STGY80H65DFB by STMicroelectronics. As a leader in semiconductor technology, STMicroelectronics delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like this N-CHANNEL transistor with built-in diode. Ideal for a variety of applications, from industrial machinery to renewable energy systems, this product offers a maximum VCEsat of 2V and a maximum collector-emitter voltage of 650V. With a package style designed for easy installation and a maximum power dissipation of 469W, the STGY80H65DFB provides exceptional value and performance for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have lower on-state resistance and faster switching speeds compared to P-Channel types, making them efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for easier circuit design and protection against voltage spikes in the system.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring efficient and reliable performance.

Maximum VCEsat: 2 V

Low VCEsat value indicates lower power dissipation and higher efficiency during operation.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into electronic systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering onto circuit boards.

Nominal Turn Off Time (toff): 358 ns

Fast turn-off time ensures quick switching and efficient power control in high-speed applications.

No. of Terminals: 3

Simple three-terminal design for easy integration into circuit systems.

Maximum Power Dissipation (Abs): 469 W

High power dissipation capability allows for handling large amounts of power without overheating.

Package Style (Meter): IN-LINE

In-line package style facilitates easy mounting and space-saving in electronic assemblies.

Maximum Operating Temperature: 175 °C

Wide operating temperature range ensures stable performance in various environmental conditions.

Maximum Collector-Emitter Voltage: 650 V

High voltage rating enables the transistor to handle high power applications safely.

Transistor Element Material: SILICON

Silicon material offers high performance and reliability for power switching applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating ensures reliable control of the transistor during operation.

Minimum Operating Temperature: -55 °C

Wide temperature range allows the transistor to operate in extreme cold environments.

Maximum Collector Current (IC): 120 A

High collector current rating enables the transistor to handle large current loads efficiently.

Maximum Gate-Emitter Threshold Voltage: 7 V

Low gate-emitter threshold voltage ensures efficient switching and control of the transistor.

Terminal Position: SINGLE

Single terminal position simplifies circuit connections and reduces complexity in system design.

Case Connection: COLLECTOR

Collector case connection allows for efficient heat dissipation during operation.

Nominal Turn On Time (ton): 128 ns

Fast turn-on time ensures quick response and efficient power control in high-speed applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGY80H65DFB attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

358 ns

Nominal Turn On Time (ton):

128 ns

Maximum VCEsat:

2 V

Trade Compliance

STGY80H65DFB Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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