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STGYA120M65DF2

STMicroelectronics

STGYA120M65DF2 by STMicroelectronics

STGYA120M65DF2 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control. It features a max VCEsat of 2.15V, supports up to 160A collector current, and operates in temperatures from -55 °C to 175 °C. Ideal for high-performance applications, it ensures reliable operation with built-in diode functionality.

Median Price

$10.040

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 526 parts In-Stock

1+ parts

$10.040

100+ parts

$5.940

1k+ parts

$4.624

10k+ parts

-

526

$10.040

$5.940

$4.624

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Mouser Electronics

USA . 377 parts In-Stock

1+ parts

$10.040

100+ parts

$5.290

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-

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377

$10.040

$5.290

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Avnet

USA . 600 parts In-Stock

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600

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Digiode

USA . 647 parts In-Stock

1+ parts

$11.942

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647

$11.942

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Vyrian

USA . 1,704 parts In-Stock

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$12.570

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1,704

$12.570

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Chip Stock

USA . 3,100 parts In-Stock

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3,100

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Anansix

USA . 833 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 712 parts In-Stock

1+ parts

$1.448

100+ parts

-

1k+ parts

$1.303

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712

$1.448

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$1.303

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MKK Technologies

India . 1,466 parts In-Stock

1+ parts

$2.723

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1,466

$2.723

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DigiPath Technology Company

USA . 1,466 parts In-Stock

1+ parts

$2.723

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1,466

$2.723

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Corphita

USA . 2,114 parts In-Stock

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$11.313

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2,114

$11.313

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Microchip USA

USA . 8,978 parts In-Stock

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$43.316

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8,978

$43.316

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Infinite Electronics LLP (Excess)

. 18,610 parts In-Stock

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18,610

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Parana Technologies

USA . 1,285 parts In-Stock

1+ parts

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100+ parts

$1.731

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1,285

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$1.731

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Overview

Elevate your power management solutions with the STGYA120M65DF2 from STMicroelectronics, a leader in semiconductor innovation. This robust IGBT combines reliability and efficiency, perfect for demanding applications like industrial drives and renewable energy systems. With its superior thermal performance and built-in diode, it ensures seamless operation and longevity. Trust in STMicroelectronics' commitment to quality and experience remarkable power control that maximizes your system's potential!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy for the package body ensures reliability and protection against environmental factors.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally offer better performance and efficiency, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode provides simplified design and helps manage reverse currents effectively.

Transistor Application: POWER CONTROL

This IGBT is designed specifically for power control applications, ensuring optimal performance in managing high power levels.

Maximum VCEsat: 2.15 V

A low VCEsat value reduces power losses in switching applications, enhancing overall efficiency.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient mounting and heat dissipation in various applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides mechanical stability and is straightforward for soldering in circuit designs.

Nominal Turn Off Time (toff): 351 ns

A nominal turn-off time of 351 ns enables faster switching, improving the performance of dynamic applications.

No. of Terminals: 3

Three terminals offer flexible connection options, making it easier to integrate into various circuits.

Maximum Power Dissipation (Abs): 625 W

With a high maximum power dissipation rating, this IGBT can handle significant power loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides secure attachment and efficient heat dissipation in high-power applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows for robust performance in demanding environments.

Maximum Collector-Emitter Voltage: 650 V

A high collector-emitter voltage rating enables operation in high-voltage applications safely.

Transistor Element Material: SILICON

Silicon as the base material provides good thermal and electrical properties, essential for reliable performance.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V offers flexibility in driving circuits with various gate drive voltages.

Minimum Operating Temperature: -55 °C

A wide temperature range from -55 °C to 175 °C ensures functionality in extreme conditions.

Maximum Collector Current (IC): 160 A

With a high collector current rating, this IGBT can effectively handle large currents in power applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

A lower gate-emitter threshold voltage allows for easier operation and better control over switching.

Terminal Position: SINGLE

A single terminal position design simplifies circuit layout and increases integration possibilities.

Case Connection: COLLECTOR

Direct collector connection enhances thermal management and electrical performance in circuits.

Nominal Turn On Time (ton): 110 ns

A quick turn-on time of 110 ns improves the responsiveness of power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGYA120M65DF2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

351 ns

Nominal Turn On Time (ton):

110 ns

Maximum VCEsat:

2.15 V

Trade Compliance

STGYA120M65DF2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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