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STGWT40H60DLFB

STMicroelectronics

STGWT40H60DLFB by STMicroelectronics

STGWT40H60DLFB by STMicroelectronics is an N-CHANNEL IGBT with 600V max collector-emitter voltage, 80A max collector current, and 283W max power dissipation. Ideal for high-power applications requiring efficient switching at up to 175 °C operating temperature.

Median Price

$4.390

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 94 parts In-Stock

1+ parts

$4.390

100+ parts

$2.461

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94

$4.390

$2.461

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Distributors (In-Stock)

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Vyrian

USA . 5,044 parts In-Stock

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5,044

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Digiode

USA . 4,754 parts In-Stock

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4,754

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Anansix

USA . 1,160 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 300 parts In-Stock

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300

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Bristol Electronics

USA . 120 parts In-Stock

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$1.810

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120

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$1.810

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Dan-Mar Components

USA . 120 parts In-Stock

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120

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 605 parts In-Stock

1+ parts

$0.507

100+ parts

-

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$0.456

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605

$0.507

-

$0.456

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MKK Technologies

India . 940 parts In-Stock

1+ parts

$0.953

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940

$0.953

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DigiPath Technology Company

USA . 940 parts In-Stock

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$0.953

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940

$0.953

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Microchip USA

USA . 451 parts In-Stock

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$27.950

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451

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Corphita

USA . 4,821 parts In-Stock

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4,821

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Perfect Parts

USA . 795 parts In-Stock

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795

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Parana Technologies

USA . 508 parts In-Stock

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$0.606

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508

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$0.606

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Overview

Experience unmatched performance and reliability with the STGWT40H60DLFB from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality in their Insulated Gate Bipolar Transistors. This N-CHANNEL IGBT offers a maximum power dissipation of 283W, making it ideal for high-power applications. With a maximum collector-emitter voltage of 600V and a collector current of 80A, this IGBT provides exceptional efficiency and durability. Trust STMicroelectronics to provide you with the best-in-class components for your power electronics needs.

Feature Benefit Bullets

N-CHANNEL

N-channel IGBTs generally have lower on-state voltage drop and higher efficiency compared to P-channel IGBTs, making them a popular choice for various applications.

Maximum Power Dissipation (Abs) 283 W

The high maximum power dissipation allows this IGBT to handle high power levels without overheating, making it suitable for demanding applications.

Maximum Operating Temperature 175 °C

With a maximum operating temperature of 175 °C, this IGBT can operate reliably in high-temperature environments, ensuring stable performance.

Maximum Collector-Emitter Voltage 600 V

The high maximum collector-emitter voltage rating of 600V allows this IGBT to be used in high-voltage applications, providing flexibility and versatility.

Maximum Gate-Emitter Voltage 20 V

The maximum gate-emitter voltage of 20V ensures safe and efficient operation of the IGBT by preventing overvoltage conditions that could damage the device.

Maximum Collector Current (IC) 80 A

With a high maximum collector current rating of 80A, this IGBT can handle substantial current levels, making it suitable for high-power applications that require high current-carrying capacity.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWT40H60DLFB attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Voltage:

20 V

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

STGWT40H60DLFB Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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