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STGWT30HP65FB

STMicroelectronics

STGWT30HP65FB by STMicroelectronics

STGWT30HP65FB from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max VCEsat of 2V, supports up to 60A collector current, and operates in temperatures ranging from -55 °C to 175 °C. Its robust design ensures reliable performance in demanding environments.

Median Price

$1.940

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 600 parts In-Stock

1+ parts

-

100+ parts

$1.830

1k+ parts

$1.640

10k+ parts

$1.540

600

-

$1.830

$1.640

$1.540

Verical

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.050

10k+ parts

$1.925

600

-

-

$2.050

$1.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,679 parts In-Stock

1+ parts

$1.928

100+ parts

-

1k+ parts

-

10k+ parts

-

1,679

$1.928

-

-

-

Vyrian

USA . 4,219 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,219

-

-

-

-

Anansix

USA . 864 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

864

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 215 parts In-Stock

1+ parts

$1.601

100+ parts

-

1k+ parts

$1.441

10k+ parts

-

215

$1.601

-

$1.441

-

Corphita

USA . 1,139 parts In-Stock

1+ parts

$1.827

100+ parts

-

1k+ parts

-

10k+ parts

-

1,139

$1.827

-

-

-

MKK Technologies

India . 2,275 parts In-Stock

1+ parts

$3.010

100+ parts

-

1k+ parts

-

10k+ parts

-

2,275

$3.010

-

-

-

DigiPath Technology Company

USA . 2,275 parts In-Stock

1+ parts

$3.010

100+ parts

-

1k+ parts

-

10k+ parts

-

2,275

$3.010

-

-

-

Microchip USA

USA . 2,892 parts In-Stock

1+ parts

$14.531

100+ parts

-

1k+ parts

-

10k+ parts

-

2,892

$14.531

-

-

-

AZTECH Wire

Italy . 458 parts In-Stock

1+ parts

$15.660

100+ parts

-

1k+ parts

-

10k+ parts

-

458

$15.660

-

-

-

Parana Technologies

USA . 1,804 parts In-Stock

1+ parts

-

100+ parts

$1.914

1k+ parts

-

10k+ parts

-

1,804

-

$1.914

-

-

Perfect Parts

USA . 941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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941

-

-

-

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Authorized Procurement Solutions

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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600

-

-

-

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Overview

Unlock unparalleled performance with the STGWT30HP65FB from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for power control applications, this N-channel IGBT combines efficiency and reliability, making it ideal for industrial automation, renewable energy systems, and motor drives. With robust thermal management and impressive switching speeds, it empowers your designs while ensuring exceptional durability and operational excellence. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and thermal stability, making the IGBT suitable for various applications.

Polarity or Channel Type: N-CHANNEL

As an N-channel device, it offers higher electron mobility, providing better efficiency and faster switching speeds.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves performance in applications requiring freewheeling capabilities.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT efficiently manages high voltages and currents.

Maximum VCEsat: 2 V

A low VCEsat specification indicates minimal conduction losses during operation, enhancing overall efficiency.

Package Shape: RECTANGULAR

The rectangular package shape provides convenient handling and mounting options in diverse applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for robust mechanical stability and ease of soldering in PCB applications.

Nominal Turn Off Time (toff): 223 ns

With a nominal turn off time of 223 ns, this device offers quick response times essential for high-frequency applications.

No. of Terminals: 3

Having three terminals optimizes its functionality and provides straightforward connection options in circuits.

Maximum Power Dissipation (Abs): 260 W

A maximum power dissipation of 260 W enables this IGBT to handle demanding power applications effectively.

Package Style (Meter): FLANGE MOUNT

The flange mount style ensures stable and secure integration into heat sinks, enhancing thermal management.

Maximum Operating Temperature: 175 °C

Operating at a maximum temperature of 175 °C allows for reliable performance in high-temperature environments.

Maximum Collector-Emitter Voltage: 650 V

A high collector-emitter voltage rating of 650 V makes this IGBT suitable for a wide range of applications.

Transistor Element Material: SILICON

Silicon as the semiconductor material provides excellent electrical properties and is widely used in power electronics.

Maximum Gate-Emitter Voltage: 20 V

With a maximum gate-emitter voltage of 20 V, it offers compatibility with standard driving circuits.

Minimum Operating Temperature: -55 °C

The minimum operating temperature of -55 °C allows the device to function in extremely cold environments.

Maximum Collector Current (IC): 60 A

Able to handle a maximum collector current of 60 A, this IGBT suits high-power applications effectively.

Maximum Gate-Emitter Threshold Voltage: 7 V

A threshold voltage of 7 V ensures efficient switching operations without excessive gate drive requirements.

Terminal Position: SINGLE

Single terminal position design simplifies layout and routing in compact electronic circuits.

Case Connection: COLLECTOR

Direct collector connection enhances thermal performance, facilitating better heat dissipation in high-load conditions.

Nominal Turn On Time (ton): 169 ns

A nominal turn on time of 169 ns indicates fast switching capabilities, improving responsiveness in control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWT30HP65FB attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

223 ns

Nominal Turn On Time (ton):

169 ns

Maximum VCEsat:

2 V

Trade Compliance

STGWT30HP65FB Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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