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STGWT20HP65FB

STMicroelectronics

STGWT20HP65FB by STMicroelectronics

STGWT20HP65FB from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max VCEsat of 2V, supports up to 650V collector-emitter voltage, and operates at temperatures from -55 °C to 175 °C. With a built-in diode and fast switching times (ton: 159ns, toff: 185ns), it's ideal for high-performance systems.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,457 parts In-Stock

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8,457

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Digiode

USA . 2,437 parts In-Stock

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Anansix

USA . 1,500 parts In-Stock

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1,500

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 942 parts In-Stock

1+ parts

$0.668

100+ parts

-

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$0.601

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942

$0.668

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$0.601

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MKK Technologies

India . 903 parts In-Stock

1+ parts

$1.256

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903

$1.256

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DigiPath Technology Company

USA . 903 parts In-Stock

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$1.256

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903

$1.256

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AZTECH Wire

Italy . 163 parts In-Stock

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$14.390

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163

$14.390

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A-Z Elektronik GmbH

Germany . 4,632 parts In-Stock

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Corphita

USA . 3,853 parts In-Stock

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Parana Technologies

USA . 2,254 parts In-Stock

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$0.799

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$0.799

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Perfect Parts

USA . 1,646 parts In-Stock

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1,646

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Unlock unparalleled efficiency and reliability with the STGWT20HP65FB from STMicroelectronics. Renowned for its commitment to innovation, STMicroelectronics delivers an IGBT that excels in power control applications, ensuring seamless performance even under demanding conditions. With its robust design and advanced thermal management, this versatile component boosts system durability while minimizing energy loss. Experience the unmatched value and peace of mind that comes with choosing a leader in semiconductor technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and resistance to environmental factors, making the IGBT suitable for harsh operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally provide better performance in terms of switching speed and efficiency, making them ideal for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The integrated diode offers enhanced voltage handling capabilities and simplifies circuit design, making it a versatile choice for power applications.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT can effectively manage high voltages and currents, suitable for various industrial applications.

Maximum VCEsat: 2 V

A low VCEsat value indicates higher efficiency and lower heat generation during operation, which helps in improving overall system performance.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier mounting and integration into PCB designs, optimizing space utilization in applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical and electrical connections, ensuring reliability in high-stress environments.

Nominal Turn Off Time (toff): 185 ns

Fast turn-off time allows for better control in switching applications, reducing the risk of thermal overload and enhancing system efficiency.

No. of Terminals: 3

Having three terminals simplifies connection and integration into circuits, making it user-friendly for designers.

Maximum Power Dissipation (Abs): 168 W

High power dissipation capability enables this IGBT to handle significant load without performance degradation, making it suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for secure attachment to heatsinks, enhancing thermal management and system reliability.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature ensures reliable performance even in extreme conditions, increasing the range of applications.

Maximum Collector-Emitter Voltage: 650 V

This high voltage rating allows for use in high-voltage applications, providing versatility and flexibility in system design.

Transistor Element Material: SILICON

Silicon material provides good thermal conductivity and reliability, ensuring long-term stability and performance of the IGBT.

Maximum Gate-Emitter Voltage: 20 V

A high maximum gate-emitter voltage gives designers flexibility in driving the IGBT, allowing for better control in various circuits.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures makes this IGBT suitable for environments with extreme temperature variations, ensuring reliability.

Maximum Collector Current (IC): 40 A

A maximum collector current of 40 A indicates capability for high current applications, increasing the device's applicability in power electronics.

Maximum Gate-Emitter Threshold Voltage: 7 V

A moderate gate-emitter threshold voltage helps reduce power requirements for turn-on, enabling efficient operation in various control systems.

Terminal Position: SINGLE

Single terminal position simplifies the layout and design of the circuit, making it more user-friendly for engineers.

Case Connection: COLLECTOR

Direct collector connection promotes efficient thermal management and performance, vital for maintaining system stability.

Nominal Turn On Time (ton): 159 ns

Quick turn-on time enhances the overall switching performance, leading to increased efficiency in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWT20HP65FB attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

185 ns

Nominal Turn On Time (ton):

159 ns

Maximum VCEsat:

2 V

Trade Compliance

STGWT20HP65FB Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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