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STGWA50H65DFB2

STMicroelectronics

STGWA50H65DFB2 by STMicroelectronics

STGWA50H65DFB2 by STMicroelectronics is an N-CHANNEL IGBT with VCEsat of 2V, IC of 86A, and Pmax of 272W. Ideal for power control applications due to its fast turn-off time (toff) of 225ns and turn-on time (ton) of 41ns. Package style is flange mount with a max operating temperature of 175°C.

Median Price

$3.113

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 600 parts In-Stock

1+ parts

$2.516

100+ parts

$1.735

1k+ parts

$1.586

10k+ parts

-

600

$2.516

$1.735

$1.586

-

Mouser Electronics

USA . 248 parts In-Stock

1+ parts

$3.000

100+ parts

$1.820

1k+ parts

$1.780

10k+ parts

-

248

$3.000

$1.820

$1.780

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Chip1Stop

Japan . 8,880 parts In-Stock

1+ parts

$3.226

100+ parts

$1.975

1k+ parts

$1.760

10k+ parts

-

8,880

$3.226

$1.975

$1.760

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DigiKey

USA . 170 parts In-Stock

1+ parts

$4.430

100+ parts

$2.068

1k+ parts

$1.670

10k+ parts

$1.555

170

$4.430

$2.068

$1.670

$1.555

Verical

USA . 600 parts In-Stock

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-

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600

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Digiode

USA . 1,664 parts In-Stock

1+ parts

$3.065

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-

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1,664

$3.065

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Vyrian

USA . 6,365 parts In-Stock

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6,365

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Anansix

USA . 1,382 parts In-Stock

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1,382

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,492 parts In-Stock

1+ parts

$0.455

100+ parts

-

1k+ parts

$0.410

10k+ parts

-

1,492

$0.455

-

$0.410

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MKK Technologies

India . 1,127 parts In-Stock

1+ parts

$0.856

100+ parts

-

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1,127

$0.856

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DigiPath Technology Company

USA . 1,127 parts In-Stock

1+ parts

$0.856

100+ parts

-

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1,127

$0.856

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Corphita

USA . 2,594 parts In-Stock

1+ parts

$2.903

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2,594

$2.903

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Microchip USA

USA . 411 parts In-Stock

1+ parts

$28.340

100+ parts

$28.170

1k+ parts

$28.080

10k+ parts

$27.990

411

$28.340

$28.170

$28.080

$27.990

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 722 parts In-Stock

1+ parts

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$0.544

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722

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$0.544

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Overview

Unleash the power of innovation with the STGWA50H65DFB2 by STMicroelectronics, a top-of-the-line Insulated Gate Bipolar Transistor designed for ultimate performance in power control applications. Manufactured with precision and excellence, this N-CHANNEL transistor offers unrivaled quality and reliability. With a maximum collector-emitter voltage of 650V and a maximum collector current of 86A, this transistor is a game-changer in the industry. Trust STMicroelectronics to deliver cutting-edge technology that exceeds expectations, providing you with the power and efficiency needed to take your projects to the next level. Elevate your designs and achieve unparalleled results with the STGWA50H65DFB2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the IGBT lightweight and durable, making it suitable for various applications without adding unnecessary weight.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have higher mobility and conductivity, making them more efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making this IGBT a convenient choice for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for high power handling and efficiency.

Maximum VCEsat: 2 V

With a low VCEsat value, this IGBT minimizes power loss and heat dissipation, improving overall efficiency.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and placement in circuits, enhancing the convenience of using this IGBT.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection in circuit boards, ensuring stable performance in power control applications.

Nominal Turn Off Time (toff): 225 ns

The short turn-off time helps in fast switching, improving the IGBT's efficiency in power control applications.

Maximum Power Dissipation (Abs): 272 W

With a high maximum power dissipation, this IGBT can handle high power levels effectively without overheating.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides easy and secure mounting, ensuring the IGBT stays in place even in high-power scenarios.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows this IGBT to be used in demanding environments without sacrificing performance.

Maximum Collector-Emitter Voltage: 650 V

With a high maximum collector-emitter voltage, this IGBT can handle high voltage levels in power control applications.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material, ensuring the durability and performance of this IGBT.

Maximum Gate-Emitter Voltage: 20 V

The high maximum gate-emitter voltage provides added protection against voltage spikes, enhancing the reliability of this IGBT.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows this IGBT to be used in a wide range of environments, from cold to hot conditions.

Maximum Collector Current (IC): 86 A

With a high maximum collector current, this IGBT can handle large current loads in power control applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

The moderate gate-emitter threshold voltage ensures efficient and reliable gate control in power control applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit connections and reduces complexity in wiring, making installation easier.

Case Connection: COLLECTOR

The collector case connection ensures efficient heat dissipation and helps maintain the IGBT's performance under high-power conditions.

Nominal Turn On Time (ton): 41 ns

The short turn-on time allows for fast switching, enhancing the overall efficiency of this IGBT in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWA50H65DFB2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

225 ns

Nominal Turn On Time (ton):

41 ns

Maximum VCEsat:

2 V

Trade Compliance

STGWA50H65DFB2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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