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STGWA35HF60WDI

STMicroelectronics

STGWA35HF60WDI by STMicroelectronics

STGWA35HF60WDI from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600V, 70A current capacity, and a fast turn-off time of 295ns. Ideal for high-performance switching in industrial systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,715 parts In-Stock

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5,715

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Digiode

USA . 3,801 parts In-Stock

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3,801

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Anansix

USA . 2,043 parts In-Stock

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2,043

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Zilex Electronics Inc.

Canada . 10 parts In-Stock

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10

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Distributors (Availability)

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Advanced Electronics

New Zealand . 79 parts In-Stock

1+ parts

$1.063

100+ parts

$0.967

1k+ parts

$0.872

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-

79

$1.063

$0.967

$0.872

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IDEA Electronic Components Group

UK . 1,104 parts In-Stock

1+ parts

$1.814

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$1.633

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1,104

$1.814

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$1.633

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MKK Technologies

India . 1,484 parts In-Stock

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$3.412

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1,484

$3.412

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DigiPath Technology Company

USA . 1,484 parts In-Stock

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$3.412

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1,484

$3.412

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AZTECH Wire

Italy . 558 parts In-Stock

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$18.400

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558

$18.400

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Corphita

USA . 3,784 parts In-Stock

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3,784

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Parana Technologies

USA . 2,005 parts In-Stock

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$2.169

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2,005

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$2.169

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Perfect Parts

USA . 1,308 parts In-Stock

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1,308

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Overview

Unlock unparalleled efficiency with the STGWA35HF60WDI from STMicroelectronics—your trusted partner in innovative power solutions. This cutting-edge Insulated Gate Bipolar Transistor (IGBT) offers exceptional performance for power control applications, ensuring reliability and durability in demanding environments. With its robust design and superior thermal management, it’s ideal for industrial automation, renewable energy systems, and more. Experience the advantage of STMicroelectronics' commitment to quality and innovation—empowering your projects with seamless power handling and advanced capabilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and resistance to environmental factors, making the IGBT suitable for various power control applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally offer better performance compared to P-channel devices, making this IGBT efficient for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances reliability and reduces design complexity, allowing for simpler circuit designs and more efficient performance.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT can handle high power loads effectively, making it ideal for various industrial uses.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy mounting and efficient heat dissipation, contributing to overall performance and reliability.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and electrical connections, ensuring stable operation under varying conditions.

Nominal Turn Off Time (toff): 295 ns

A fast turn-off time allows for quick switching in applications, improving efficiency and reducing switching losses.

No. of Terminals: 3

Having three terminals simplifies the design, allowing for versatile applications while maintaining functional integrity.

Maximum Power Dissipation (Abs): 260 W

The high power dissipation capability allows this IGBT to operate under substantial loads without overheating, enhancing reliability in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design facilitates easy installation and offers excellent thermal performance, making it suitable for high-power applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows the IGBT to function efficiently in high-temperature environments, broadening its application range.

Maximum Collector-Emitter Voltage: 600 V

With a high collector-emitter voltage rating, this IGBT is suitable for applications that require handling high voltage safely and effectively.

Transistor Element Material: SILICON

The use of silicon as the element material ensures good electrical performance and thermal conductivity, ensuring reliable operation.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V provides flexibility in driving the IGBT, allowing it to interface with various control circuits.

Maximum Collector Current (IC): 70 A

With a collector current rating of 70 A, this IGBT can efficiently manage high-load applications, making it versatile and robust.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A low gate-emitter threshold voltage ensures easy turn-on, enhancing performance in various control applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides good solderability and corrosion resistance, ensuring reliable long-term connections.

Terminal Position: SINGLE

A single terminal position simplifies the design process and offers ease of integration into circuits.

Nominal Turn On Time (ton): 45 ns

A short turn-on time reduces switching losses and enhances the overall efficiency of power control circuits.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWA35HF60WDI attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

295 ns

Nominal Turn On Time (ton):

45 ns

Trade Compliance

STGWA35HF60WDI Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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