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STGWA15M120DF3

STMicroelectronics

STGWA15M120DF3 by STMicroelectronics

STGWA15M120DF3 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max VCEsat of 2.3V, supports up to 1200V collector-emitter voltage, and has a max power dissipation of 259W. Ideal for high-performance switching in industrial systems.

Median Price

$2.855

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 15,600 parts In-Stock

1+ parts

$3.873

100+ parts

$2.674

1k+ parts

$2.100

10k+ parts

-

15,600

$3.873

$2.674

$2.100

-

Mouser Electronics

USA . 467 parts In-Stock

1+ parts

$5.150

100+ parts

$2.720

1k+ parts

$1.950

10k+ parts

-

467

$5.150

$2.720

$1.950

-

Arrow

USA . 47,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.837

10k+ parts

-

47,400

-

-

$1.837

-

Verical

USA . 47,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.837

10k+ parts

-

47,400

-

-

$1.837

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,929 parts In-Stock

1+ parts

$3.679

100+ parts

-

1k+ parts

-

10k+ parts

-

4,929

$3.679

-

-

-

Chip Stock

USA . 9,410 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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9,410

-

-

-

-

Vyrian

USA . 7,935 parts In-Stock

1+ parts

-

100+ parts

-

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-

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7,935

-

-

-

-

Anansix

USA . 1,519 parts In-Stock

1+ parts

-

100+ parts

-

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-

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1,519

-

-

-

-

ComSIT Distribution GmbH

Germany . 600 parts In-Stock

1+ parts

-

100+ parts

-

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-

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600

-

-

-

-

R&J Components

USA . 557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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557

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,761 parts In-Stock

1+ parts

$0.684

100+ parts

-

1k+ parts

$0.616

10k+ parts

-

1,761

$0.684

-

$0.616

-

MKK Technologies

India . 1,764 parts In-Stock

1+ parts

$1.287

100+ parts

-

1k+ parts

-

10k+ parts

-

1,764

$1.287

-

-

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DigiPath Technology Company

USA . 1,764 parts In-Stock

1+ parts

$1.287

100+ parts

-

1k+ parts

-

10k+ parts

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1,764

$1.287

-

-

-

Corphita

USA . 4,305 parts In-Stock

1+ parts

$3.486

100+ parts

-

1k+ parts

-

10k+ parts

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4,305

$3.486

-

-

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Microchip USA

USA . 8,585 parts In-Stock

1+ parts

$21.514

100+ parts

-

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10k+ parts

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8,585

$21.514

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A-Z Elektronik GmbH

Germany . 6,009 parts In-Stock

1+ parts

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100+ parts

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6,009

-

-

-

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Parana Technologies

USA . 588 parts In-Stock

1+ parts

-

100+ parts

$0.818

1k+ parts

-

10k+ parts

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588

-

$0.818

-

-

Overview

Unlock unparalleled performance with the STGWA15M120DF3 IGBT from STMicroelectronics, a trusted leader in innovation. This robust N-channel transistor excels in power control applications, delivering reliability and efficiency even in extreme environments. With its built-in diode and high power dissipation capabilities, it ensures seamless operation for demanding projects. Trust in STMicroelectronics' exceptional quality to elevate your designs and maximize productivity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package offers excellent protection against environmental factors, enhancing the reliability of the IGBT.

Polarity or Channel Type: N-CHANNEL

N-channel configuration allows for efficient switching performance, making it suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides protection against reverse current, improving overall system robustness.

Transistor Application: POWER CONTROL

Optimized for power control applications, this IGBT is ideal for managing high voltage and current loads effectively.

Maximum VCEsat: 2.3 V

A low VCEsat indicates high efficiency and minimal power loss during operation, contributing to better overall performance.

Package Shape: RECTANGULAR

The rectangular shape aids in easy integration into various circuit layouts and ensures efficient thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides enhanced mechanical stability and is suitable for high-power applications where robustness is critical.

Nominal Turn Off Time (toff): 406 ns

A fast turn-off time allows for quick switching in fast-paced applications, improving system responsiveness.

No. of Terminals: 3

The three-terminal design simplifies connections, making it easier to integrate into complex circuits.

Maximum Power Dissipation (Abs): 259 W

With a high power dissipation capacity, this IGBT can handle significant loads, making it suitable for demanding power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for efficient heat dissipation and secure mounting, crucial for high power setups.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature expands the range of applicable environments, ensuring reliability under extreme conditions.

Maximum Collector-Emitter Voltage: 1200 V

With a high voltage rating, this IGBT can be used in various high-voltage applications, enhancing its versatility.

Transistor Element Material: SILICON

Silicon-based construction provides good thermal conductivity and ensures reliable performance in power applications.

Maximum Gate-Emitter Voltage: 20 V

Allows for adequate gate control while ensuring the safe operation of the transistor, reducing the risk of damage.

Minimum Operating Temperature: -55 °C

The capability to operate in extremely low temperatures enhances suitability for applications in harsh environments.

Maximum Collector Current (IC): 30 A

A high current rating makes this IGBT ideal for applications that involve substantial power handling.

Maximum Gate-Emitter Threshold Voltage: 7 V

Provides precise control over the conduction state, ensuring efficient operation across various applications.

Terminal Position: SINGLE

Single terminal positioning simplifies circuit design and improves integration into existing systems.

Case Connection: COLLECTOR

This arrangement allows for straightforward connection to the circuit, enhancing ease of use in assembly.

Nominal Turn On Time (ton): 39 ns

A fast turn-on time enables rapid switching, making this IGBT suitable for high-speed applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWA15M120DF3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

406 ns

Nominal Turn On Time (ton):

39 ns

Maximum VCEsat:

2.3 V

Trade Compliance

STGWA15M120DF3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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