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STGW40NC60V

STMicroelectronics

STGW40NC60V by STMicroelectronics

STGW40NC60V from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600 V, a nominal turn-off time of 247 ns, and operates at up to 150 °C. Ideal for high-performance switching in industrial systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,114 parts In-Stock

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Anansix

USA . 1,225 parts In-Stock

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R&J Components

USA . 420 parts In-Stock

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420

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Digiode

USA . 305 parts In-Stock

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PC Components Company LLC

USA . 30 parts In-Stock

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Inventory MP

USA . 28 parts In-Stock

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Bristol Electronics

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Elcom Components

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 152 parts In-Stock

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$0.650

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$0.585

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MKK Technologies

India . 70 parts In-Stock

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$1.221

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DigiPath Technology Company

USA . 70 parts In-Stock

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$1.221

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AZTECH Wire

Italy . 1,136 parts In-Stock

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$9.780

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Component Stockers USA

USA . 562 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 20,909 parts In-Stock

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Corphita

USA . 4,990 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Microchip USA

USA . 3,923 parts In-Stock

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Parana Technologies

USA . 1,602 parts In-Stock

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$0.777

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RC Electronics

USA . 300 parts In-Stock

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Perfect Parts

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Overview

Unlock unparalleled performance with the STGW40NC60V from STMicroelectronics, your trusted partner in innovative solutions. This robust IGBT delivers exceptional power control for a wide range of applications, ensuring efficiency and reliability in every project. With a commitment to quality and cutting-edge technology, STMicroelectronics empowers customers to enhance their designs while enjoying superior thermal management and longevity. Elevate your next project with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy materials provides durability and resistance to environmental factors, ensuring reliable operation in various conditions.

Polarity or Channel Type: N-CHANNEL

N-channel configuration allows for efficient electrical conduction, making it suitable for high-performance power applications.

Configuration: SINGLE

Single configuration simplifies circuit design and integration, making it easy to implement in various power control systems.

Transistor Application: POWER CONTROL

Optimized for power control, ensuring precise management of energy in power electronics, enhancing performance in applications.

Package Shape: RECTANGULAR

Rectangular package shape enables efficient use of space on the PCB and facilitates easy mounting in electronic designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal design provides robust mechanical support and better heat dissipation, enhancing reliability in high-current applications.

Nominal Turn Off Time (toff): 247 ns

A fast turn-off time improves switching efficiency, reducing losses, and allowing for higher frequency operation in power circuits.

No. of Terminals: 3

Having three terminals simplifies the connection process while providing necessary functionality for effective operation.

Package Style (Meter): FLANGE MOUNT

Flange mounting style provides stable and secure attachment, enhancing reliability and ease of installation in various setups.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature extends the range of applications, enabling its use in demanding environments.

Maximum Collector-Emitter Voltage: 600 V

A maximum voltage of 600 V allows the device to operate in high-voltage applications, expanding its versatility in power control.

Transistor Element Material: SILICON

Silicon-based construction offers excellent electrical properties, ensuring stable performance and reliability in power electronic systems.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V ensures compatibility with standard gate drive circuits, enhancing ease of integration.

Maximum Collector Current (IC): 80 A

A high maximum collector current rating supports demanding power applications, allowing significant current handling without performance degradation.

Maximum Gate-Emitter Threshold Voltage: 5 V

Low threshold voltage ensures sensitive operation, enabling the device to respond effectively to control signals for better efficiency.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides excellent solderability, ensuring reliable connections and reducing the risk of oxidation over time.

Terminal Position: SINGLE

Single terminal position allows easy connection and integration into a variety of circuit layouts.

Nominal Turn On Time (ton): 61 ns

A low turn-on time results in quick response to control signals, improving the overall efficiency and performance of power circuits.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW40NC60V attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

247 ns

Nominal Turn On Time (ton):

61 ns

Trade Compliance

STGW40NC60V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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