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STGW30H60DF

STMicroelectronics

STGW30H60DF by STMicroelectronics

STGW30H60DF by STMicroelectronics is an N-CHANNEL IGBT with VCEsat of 2.4V and IC of 60A. Ideal for POWER CONTROL applications, it has a max VCE of 600V and can dissipate up to 260W at temperatures ranging from -40 to 175 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,422 parts In-Stock

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Vyrian

USA . 2,158 parts In-Stock

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Anansix

USA . 2,013 parts In-Stock

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IDEA Electronic Components Group

UK . 1,187 parts In-Stock

1+ parts

$1.006

100+ parts

-

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$0.906

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1,187

$1.006

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$0.906

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MKK Technologies

India . 716 parts In-Stock

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$1.893

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716

$1.893

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DigiPath Technology Company

USA . 716 parts In-Stock

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$1.893

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716

$1.893

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Andel Nordic

Denmark . 4,429 parts In-Stock

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$6.131

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$5.886

10k+ parts

$5.886

4,429

$6.131

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$5.886

$5.886

AZTECH Wire

Italy . 130 parts In-Stock

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$11.630

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130

$11.630

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Parana Technologies

USA . 1,956 parts In-Stock

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$1.203

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1,956

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$1.203

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Perfect Parts

USA . 1,243 parts In-Stock

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Corphita

USA . 1,042 parts In-Stock

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Overview

Experience the power of innovation with the STGW30H60DF by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. Designed for power control applications, this N-CHANNEL transistor offers a maximum VCEsat of 2.4V and a maximum collector-emitter voltage of 600V, ensuring optimal performance. With a nominal turn-off time of 234ns and a maximum power dissipation of 260W, this product is a game-changer in the market. Elevate your projects to new heights with the STGW30H60DF and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and protection for the internal components of the IGBT, making it a reliable choice for long-term use.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically offer lower conduction losses and higher efficiency compared to P-Channel IGBTs, making them suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode helps with switching performance and protects against voltage spikes, enhancing the reliability of the IGBT in power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance and efficiency.

Maximum VCEsat: 2.4 V

Low VCEsat value indicates lower conduction losses and higher efficiency, making it suitable for power control applications where energy efficiency is crucial.

Maximum Power Dissipation (Abs): 260 W

High power dissipation capability allows the IGBT to handle large amounts of power without overheating, making it reliable for high-power applications.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating ensures the IGBT can withstand high voltage levels, making it suitable for a wide range of power control applications.

Maximum Collector Current (IC): 60 A

High collector current rating allows the IGBT to handle high currents, making it suitable for power control applications requiring high current capacity.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW30H60DF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

234 ns

Nominal Turn On Time (ton):

64 ns

Maximum VCEsat:

2.4 V

Trade Compliance

STGW30H60DF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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