Loading...

STGP30H65DFB2

STMicroelectronics

STGP30H65DFB2 by STMicroelectronics

STGP30H65DFB2 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control. It features a max VCEsat of 2.1V, supports up to 50A collector current, and operates in temperatures from -55 °C to 175 °C. Ideal for high-performance applications, it ensures reliable operation with built-in diode support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

800

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,420

-

-

-

-

Digiode

USA . 560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

560

-

-

-

-

Anansix

USA . 536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

536

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,246 parts In-Stock

1+ parts

$0.637

100+ parts

-

1k+ parts

$0.573

10k+ parts

-

2,246

$0.637

-

$0.573

-

MKK Technologies

India . 688 parts In-Stock

1+ parts

$1.197

100+ parts

-

1k+ parts

-

10k+ parts

-

688

$1.197

-

-

-

DigiPath Technology Company

USA . 688 parts In-Stock

1+ parts

$1.197

100+ parts

-

1k+ parts

-

10k+ parts

-

688

$1.197

-

-

-

Microchip USA

USA . 9,281 parts In-Stock

1+ parts

$8.704

100+ parts

-

1k+ parts

-

10k+ parts

-

9,281

$8.704

-

-

-

AZTECH Wire

Italy . 469 parts In-Stock

1+ parts

$12.270

100+ parts

-

1k+ parts

-

10k+ parts

-

469

$12.270

-

-

-

Corphita

USA . 4,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,740

-

-

-

-

Parana Technologies

USA . 2,308 parts In-Stock

1+ parts

-

100+ parts

$0.761

1k+ parts

-

10k+ parts

-

2,308

-

$0.761

-

-

Overview

Unlock unparalleled performance in power control applications with the STGP30H65DFB2 from STMicroelectronics. Renowned for their cutting-edge technology and reliability, STMicroelectronics delivers this N-channel IGBT, designed to optimize efficiency in a variety of settings. With its robust thermal management and swift switching capabilities, the STGP30H65DFB2 ensures superior energy savings and longevity, making it the ideal choice for advanced industrial systems and renewable energy solutions. Experience excellence with STMicroelectronics—where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and cost-effectiveness, making it suitable for a range of applications.

Polarity or Channel Type: N-CHANNEL

Being an N-channel device provides lower conduction losses and is often preferred in power control applications for efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration allows for easy integration into circuits, providing inherent protection against voltage spikes.

Transistor Application: POWER CONTROL

Ideal for applications requiring efficient power management, making it versatile for industrial and consumer electronics.

Maximum VCEsat: 2.1 V

A low maximum VCEsat indicates reduced power losses during operation, enhancing overall efficiency and performance.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs and facilitates thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures strong mechanical connection and long-term reliability in high-power applications.

Nominal Turn Off Time (toff): 184 ns

A relatively fast turn off time enhances switching performance, suitable for high-frequency applications.

No. of Terminals: 3

Three terminals allow for straightforward connections, simplifying the design process for engineers.

Maximum Power Dissipation (Abs): 167 W

High power dissipation capability ensures that the device can handle demanding applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides ease of installation and better heat dissipation, suitable for various mounting arrangements.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows the device to function reliably in aggressive environments.

Maximum Collector-Emitter Voltage: 650 V

A maximum VCE of 650 V allows for applications in high-voltage systems, extending its usability.

Transistor Element Material: SILICON

Silicon as the transistor element material is common for IGBTs, providing good performance and reliability.

Maximum Gate-Emitter Voltage: 20 V

The ability to handle up to 20 V on the gate-emitter provides design flexibility and protects the internal structure.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature ensures the device can function well in harsh and cold environments.

Maximum Collector Current (IC): 50 A

Handling up to 50 A makes this IGBT suitable for high-current applications, ensuring effective power management.

Maximum Gate-Emitter Threshold Voltage: 7 V

Low threshold voltage allows for easier and more efficient control, enhancing response time in circuit applications.

Terminal Position: SINGLE

A single terminal position simplifies board layout and minimizes complexity in circuit design.

Case Connection: COLLECTOR

Collector connection enhances thermal performance and optimizes overall device efficiency.

Nominal Turn On Time (ton): 27.5 ns

Fast turn on time makes the IGBT suitable for high-speed switching applications, improving overall performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGP30H65DFB2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

184 ns

Nominal Turn On Time (ton):

27.5 ns

Maximum VCEsat:

2.1 V

Trade Compliance

STGP30H65DFB2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20