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STG3P2M10N60B

STMicroelectronics

STG3P2M10N60B by STMicroelectronics

STG3P2M10N60B from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control. It features a max VCEsat of 2.5V, supports up to 600V, and has a nominal turn-off time of just 99ns. Ideal for high-performance applications in industrial drives and renewable energy systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 2,427 parts In-Stock

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Vyrian

USA . 1,953 parts In-Stock

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Anansix

USA . 1,577 parts In-Stock

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IDEA Electronic Components Group

UK . 2,082 parts In-Stock

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$1.385

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$1.246

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$1.385

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$1.246

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MKK Technologies

India . 1,201 parts In-Stock

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$2.604

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DigiPath Technology Company

USA . 1,201 parts In-Stock

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$2.604

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$2.604

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Andel Nordic

Denmark . 1,803 parts In-Stock

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$4.623

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$4.438

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$4.438

1,803

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$4.438

AZTECH Wire

Italy . 825 parts In-Stock

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$20.220

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825

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Microchip USA

USA . 449 parts In-Stock

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$28.271

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Corphita

USA . 4,149 parts In-Stock

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Kepictronics

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Parana Technologies

USA . 289 parts In-Stock

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$1.656

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Perfect Parts

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Overview

Elevate your power control solutions with the STG3P2M10N60B IGBT from STMicroelectronics, a leader in semiconductor innovation. Designed for efficiency and reliability, this N-channel device features six integrated elements, ensuring superior performance in demanding applications. With its robust construction and rapid response times, it excels in renewable energy systems, motor drives, and industrial automation, delivering exceptional value and unmatched durability to optimize your designs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer better electron mobility, which leads to improved performance in power control applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE

A bridge configuration with built-in diode enhances efficiency and reduces the number of external components needed for power management.

Transistor Application: POWER CONTROL

Specifically designed for power control, making it ideal for applications requiring efficient energy management.

Maximum VCEsat: 2.5 V

A low saturation voltage translates into higher efficiency and reduced power losses during operation.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient heat dissipation and easier integration into various circuit designs.

No. of Elements: 6

With six elements, this IGBT provides enhanced functionality, making it suitable for complex power control applications.

Nominal Turn Off Time (toff): 99 ns

A relatively short turn-off time aids in faster switching applications, improving overall system responsiveness.

No. of Terminals: 16

Having 16 terminals allows for flexible connectivity options and simplifies circuit design for various applications.

Maximum Power Dissipation (Abs): 56 W

A high power dissipation rating enables this IGBT to manage substantial thermal loads, ensuring reliable operation in demanding environments.

Package Style (Meter): FLANGE MOUNT

Flange mount style offers robust mechanical support and easy mounting, enhancing system reliability.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures that this IGBT can function effectively in harsh environments without performance degradation.

Maximum Collector-Emitter Voltage: 600 V

This high voltage rating allows the IGBT to be used in high-voltage applications, adding versatility to its operational range.

Transistor Element Material: SILICON

Silicon material provides good thermal conductivity and reliable performance characteristics critical for power electronics.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V ensures compatibility with standard gate drive circuits for easy integration.

Maximum Collector Current (IC): 19 A

A relatively high maximum collector current makes this IGBT suitable for handling substantial power loads in various applications.

Terminal Position: UPPER

Upper terminal positioning provides practical access for connections, facilitating easier assembly and maintenance.

Nominal Turn On Time (ton): 27 ns

A short turn-on time enhances quick response capabilities, which is crucial for fast switching applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STG3P2M10N60B attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X16

No. of Elements:

6

No. of Terminals:

16

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

99 ns

Nominal Turn On Time (ton):

27 ns

Maximum VCEsat:

2.5 V

Trade Compliance

STG3P2M10N60B Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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