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STG35M120F3D8

STMicroelectronics

STG35M120F3D8 by STMicroelectronics

STG35M120F3D8 from STMicroelectronics is a single N-channel IGBT ideal for power control applications. It features a max VCEsat of 1.9V, operates up to 175 °C, and supports voltages up to 1200V. Its compact no-lead design enhances efficiency in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 2,589 parts In-Stock

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Anansix

USA . 654 parts In-Stock

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Vyrian

USA . 398 parts In-Stock

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398

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 87 parts In-Stock

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$0.422

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$0.380

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87

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MKK Technologies

India . 587 parts In-Stock

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$0.794

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DigiPath Technology Company

USA . 587 parts In-Stock

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$0.794

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Parana Technologies

USA . 786 parts In-Stock

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$0.505

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Corphita

USA . 322 parts In-Stock

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Overview

Unlock unparalleled performance with the STG35M120F3D8 from STMicroelectronics, a leader in semiconductor innovations. This N-Channel Insulated Gate Bipolar Transistor (IGBT) excels in power control applications, ensuring superior efficiency and reliability even in extreme conditions. Its compact design optimizes space without compromising quality, making it perfect for various industries. Trust in STMicroelectronics to deliver exceptional value and cutting-edge technology that drives your success!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors generally exhibit better electron mobility, making them more efficient for high-speed applications.

Configuration: SINGLE

A single configuration enhances simplicity in circuit design, making it easier to integrate into various applications.

Transistor Application: POWER CONTROL

Designed specifically for power control, making it suitable for applications requiring precise voltage and current management.

Surface Mount: YES

Surface mount capability allows for smaller circuit designs and improved thermal performance due to better heat dissipation.

Maximum VCEsat: 1.9 V

A low saturation voltage helps to reduce power losses during operation, enhancing overall efficiency.

Package Shape: RECTANGULAR

Rectangular packaging can optimize board space and provide efficient layout options for circuit designers.

Terminal Form: NO LEAD

No lead terminal form helps facilitate a compact design and reduces the risk of mechanical failures in high-stress environments.

Nominal Turn Off Time (toff): 142.84 ns

Fast turn-off time allows for quicker switching, improving performance in high-frequency applications.

No. of Terminals: 3

With three terminals, it provides a straightforward connection for versatile applications while maintaining compactness.

Package Style (Meter): UNCASED CHIP

Uncased chip design allows for flexible mounting options while ensuring thermal efficiency in heat-sensitive applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature indicates robust reliability in demanding environments, extending component lifespan.

Maximum Collector-Emitter Voltage: 1200 V

A high collector-emitter voltage allows for use in applications with significant voltage requirements, offering greater design flexibility.

Transistor Element Material: SILICON

Silicon offers established performance and reliability, making it a trusted choice for a wide range of applications.

Maximum Gate-Emitter Voltage: 20 V

Adequate gate-emitter voltage ensures compatibility with standard driving circuits, enhancing integration ease.

Minimum Operating Temperature: -55 °C

Wide operating temperature range ensures reliable performance in extreme conditions, broadening application possibilities.

Maximum Gate-Emitter Threshold Voltage: 7 V

Lower threshold voltage simplifies driving requirements, making it suitable for low-voltage control circuits.

Terminal Position: UPPER

Upper terminal positioning allows for easier access and connection in circuit layouts, facilitating better design flow.

Nominal Turn On Time (ton): 145 ns

Quick turn-on time enhances responsiveness in switching applications, making it ideal for high-speed power electronics.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STG35M120F3D8 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUUC-N3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

142.84 ns

Nominal Turn On Time (ton):

145 ns

Maximum VCEsat:

1.9 V

Trade Compliance

STG35M120F3D8 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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