Loading...

STG3P3M25N60

STMicroelectronics

STG3P3M25N60 by STMicroelectronics

STG3P3M25N60 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control. It features a max VCEsat of 2.5V, supports up to 600V collector-emitter voltage, and has a nominal turn-off time of 128ns. Ideal for high-performance applications in industrial drives and renewable energy systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,340

-

-

-

-

Digiode

USA . 3,431 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,431

-

-

-

-

Anansix

USA . 748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

748

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$0.854

100+ parts

$0.777

1k+ parts

$0.700

10k+ parts

-

450

$0.854

$0.777

$0.700

-

IDEA Electronic Components Group

UK . 1,021 parts In-Stock

1+ parts

$1.455

100+ parts

-

1k+ parts

$1.309

10k+ parts

-

1,021

$1.455

-

$1.309

-

MKK Technologies

India . 880 parts In-Stock

1+ parts

$2.735

100+ parts

-

1k+ parts

-

10k+ parts

-

880

$2.735

-

-

-

DigiPath Technology Company

USA . 880 parts In-Stock

1+ parts

$2.735

100+ parts

-

1k+ parts

-

10k+ parts

-

880

$2.735

-

-

-

Corphita

USA . 1,030 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,030

-

-

-

-

Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Parana Technologies

USA . 859 parts In-Stock

1+ parts

-

100+ parts

$1.739

1k+ parts

-

10k+ parts

-

859

-

$1.739

-

-

Overview

Unlock unparalleled performance with the STG3P3M25N60 from STMicroelectronics! This cutting-edge IGBT delivers exceptional power control in a compact, robust design, ideal for demanding applications like motor drives and renewable energy systems. With its impressive efficiency and reliability, you can trust this device to optimize your operations while reducing energy costs. Experience unmatched quality and innovation from a leader in semiconductor solutions—choose STMicroelectronics for your next project!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel devices generally offer lower on-state resistance and higher efficiency, making them ideal for power control applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for efficient power conversion and improved performance in various applications, reinforcing the device's reliability.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is optimized to handle high voltages and currents effectively, catering to demanding applications.

Maximum VCEsat: 2.5 V

A low VCEsat value ensures lower conduction losses, enhancing efficiency and providing better thermal management.

Package Shape: RECTANGULAR

The rectangular package shape allows for easier mounting and integration into various design layouts, facilitating more compact designs.

No. of Elements: 6

Having 6 elements increases the overall efficiency and performance of the device, making it suitable for higher power applications.

Nominal Turn Off Time (toff): 128 ns

A fast turn-off time minimizes switching losses, which is critical for high-frequency applications and enhances overall device performance.

No. of Terminals: 28

An ample number of terminals allows for versatile connections, making it adaptable to various circuit designs.

Maximum Power Dissipation (Abs): 96 W

With a high power dissipation capacity, this product can handle significant amounts of power without overheating, ensuring reliability in demanding conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides secure heat dissipation and mechanical stability, making it ideal for rugged environments.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures robustness and reliable performance even in extreme conditions, making it suitable for industrial applications.

Maximum Collector-Emitter Voltage: 600 V

A high voltage rating allows this IGBT to be used in a variety of applications, including those requiring substantial electrical isolation.

Transistor Element Material: SILICON

Silicon as the base material offers proven reliability and performance, making the IGBT compatible with existing technologies.

Maximum Gate-Emitter Voltage: 20 V

A robust gate-emitter voltage ensures steady operation and compatibility with industry-standard driving circuits.

Maximum Collector Current (IC): 50 A

This high collector current rating enables the device to support substantial load demands, making it suitable for heavy-duty applications.

Terminal Position: UPPER

Upper terminal positioning allows for efficient circuit design and simplifies integration into existing layouts.

Nominal Turn On Time (ton): 42 ns

A fast turn-on time aids in high-speed switching applications, contributing to improved overall system responsiveness.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STG3P3M25N60 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X28

No. of Elements:

6

No. of Terminals:

28

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

128 ns

Nominal Turn On Time (ton):

42 ns

Maximum VCEsat:

2.5 V

Trade Compliance

STG3P3M25N60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 6