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STB60NF06-1

STMicroelectronics

STB60NF06-1 by STMicroelectronics

STB60NF06-1 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 60V breakdown voltage, 240A max pulsed drain current, and operates at up to 175 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,635 parts In-Stock

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2,635

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Anansix

USA . 788 parts In-Stock

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788

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Digiode

USA . 227 parts In-Stock

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227

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,261 parts In-Stock

1+ parts

$1.162

100+ parts

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1k+ parts

$1.046

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2,261

$1.162

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$1.046

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MKK Technologies

India . 1,124 parts In-Stock

1+ parts

$2.185

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1,124

$2.185

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DigiPath Technology Company

USA . 1,124 parts In-Stock

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$2.185

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1,124

$2.185

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Parana Technologies

USA . 873 parts In-Stock

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$1.389

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873

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$1.389

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Corphita

USA . 304 parts In-Stock

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304

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Overview

Unlock the power of efficiency with the STB60NF06-1 by STMicroelectronics! Renowned for their cutting-edge technology, STMicroelectronics brings you a high-performance N-channel FET that's perfect for demanding switching applications. With robust durability and impressive thermal performance, this transistor ensures reliable operation in various environments. Enhance your designs with exceptional value and reliability, empowering your projects to achieve greater energy savings and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making this FET suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and higher efficiency than P-channel counterparts, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The integrated diode provides additional protection against reverse voltage, enhancing overall reliability in circuits.

Transistor Application: SWITCHING

Optimized for switching applications, this FET allows for fast operation and energy efficiency, crucial for modern electronic designs.

Minimum DS Breakdown Voltage: 60 V

A minimum breakdown voltage of 60 V ensures that it can handle high-voltage applications, making it suitable for a variety of power systems.

Package Shape: RECTANGULAR

The rectangular package shape can facilitate compact PCB layouts, which is essential in space-constrained applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and reliable solder joints, ensuring stable connections in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers higher efficiency and better performance in switching applications, making it an excellent choice for power control.

Maximum Pulsed Drain Current (IDM): 240 A

With a maximum pulsed drain current of 240 A, this FET can handle significant load variations, suitable for dynamic applications.

Avalanche Energy Rating (EAS): 360 mJ

A high avalanche energy rating indicates resilience against voltage spikes, reducing the risk of damage during operation.

Maximum Drain Current (Abs) (ID): 60 A

A maximum drain current of 60 A provides ample current handling capacity for demanding applications.

No. of Terminals: 3

Having 3 terminals allows for a simple integration into circuits while maintaining effective functionality.

Maximum Power Dissipation (Abs): 110 W

The ability to dissipate up to 110 W of power makes this FET efficient in high-power applications, minimizing thermal issues.

Package Style (Meter): IN-LINE

Inline package style is advantageous for prototyping and integration into various board designs, enhancing usability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology enables high-speed switching and low gate power consumption, ideal for energy-efficient designs.

Maximum Operating Temperature: 175 °C

An operational temperature rating of 175 °C ensures stable performance in high-temperature environments, increasing versatility.

Transistor Element Material: SILICON

Silicon as the material choice provides good thermal properties and reliable performance in various applications.

Terminal Finish: TIN

Tin-finished terminals offer excellent solderability and corrosion resistance, ensuring reliable electrical connections.

Maximum Drain Current (ID): 60 A

The reiteration of a maximum drain current of 60 A further emphasizes its robustness for heavy-duty applications.

Maximum Drain-Source On Resistance: 0.016 ohm

A low on-resistance value minimizes power loss and heat generation, enhancing efficiency in power switching applications.

Terminal Position: SINGLE

A single terminal position allows for easier layout and integration into existing designs, promoting versatility.

Case Connection: ISOLATED

Isolated case connection prevents interference with other components, maintaining signal integrity in complex circuits.

Technical Specifications

Power Field Effect Transistors (FET) STB60NF06-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

360 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.016 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB60NF06-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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