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STB60NE06L-16T4

STMicroelectronics

STB60NE06L-16T4 by STMicroelectronics

STB60NE06L-16T4 by STMicroelectronics is a N-CHANNEL FET with 60V DS Breakdown Voltage, 240A IDM, and 0.016 ohm RDS(on). Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE at up to 175 °C, making it suitable for high-power tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 7,710 parts In-Stock

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7,710

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Digiode

USA . 3,095 parts In-Stock

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3,095

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Vyrian

USA . 2,829 parts In-Stock

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2,829

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Anansix

USA . 1,098 parts In-Stock

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1,098

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LIBRA Elektronik GmbH

Germany . 905 parts In-Stock

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905

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,003 parts In-Stock

1+ parts

$0.445

100+ parts

-

1k+ parts

$0.401

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2,003

$0.445

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$0.401

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MKK Technologies

India . 1,203 parts In-Stock

1+ parts

$0.837

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1,203

$0.837

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DigiPath Technology Company

USA . 1,203 parts In-Stock

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$0.837

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1,203

$0.837

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Semicontronic

India . 416 parts In-Stock

1+ parts

$15.050

100+ parts

$14.674

1k+ parts

$14.598

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416

$15.050

$14.674

$14.598

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AZTECH Wire

Italy . 840 parts In-Stock

1+ parts

$17.810

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840

$17.810

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GreenTree Electronics

Israel . 125,000 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,586 parts In-Stock

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8,586

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A-Z Elektronik GmbH

Germany . 5,616 parts In-Stock

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5,616

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Alle Elektronik GmbH

Germany . 4,844 parts In-Stock

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4,844

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Corphita

USA . 1,459 parts In-Stock

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1,459

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

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1,100

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Parana Technologies

USA . 1,092 parts In-Stock

1+ parts

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$0.532

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1,092

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$0.532

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Overview

Unlock the power of innovation with the STB60NE06L-16T4 by STMicroelectronics, a high-quality Power FET designed for switching applications. Crafted with expertise and precision, this N-CHANNEL transistor offers exceptional performance and reliability. Ideal for a wide range of electronic devices, this product provides customers with unmatched value, efficiency, and ease of use. Experience the benefits of cutting-edge technology and elevate your projects to new heights with the STB60NE06L-16T4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the transistor, making it suitable for various industrial applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and are more efficient than P-channel FETs, making them a better choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect against reverse polarity and can simplify circuit design, making this FET a convenient choice for many applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high speed and efficiency when turning on and off, making it ideal for power management in various systems.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and enabling automated assembly processes.

Maximum Pulsed Drain Current (IDM): 240 A

High pulsed drain current rating makes this FET suitable for applications requiring short bursts of high power.

Maximum Power Dissipation (Abs): 150 W

With a high power dissipation rating, this FET can handle significant heat dissipation, ensuring reliable operation in high-power applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature tolerance allows this FET to operate reliably in harsh environments without overheating.

Maximum Drain-Source On Resistance: 0.016 ohm

Low drain-source on resistance minimizes power loss and heat generation, making this FET highly efficient for power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) STB60NE06L-16T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Avalanche Energy Rating (EAS):

400 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.016 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB60NE06L-16T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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